PIC24F16KA102-I/SS Microchip Technology, PIC24F16KA102-I/SS Datasheet - Page 23

• Manufacturer Part Number: PIC24F16KA102-I/SS
• Description: IC PIC MCU FLASH 16K 28-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24F16KA102-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 16KB (5.5K x 24)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 512 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24F
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 1.5 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA240017 - MODULE PLUG-IN PIC24F16KA102 PIM
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.0
This section describes the programming of the device
through Enhanced ICSP and the programming
executive. The programming executive resides in the
executive memory (separate from user memory
space), and is executed when Enhanced ICSP
Programming mode is entered. The programming
executive provides the mechanism for the programmer
(host
PIC24FXXKAXXX devices using a simple command
set and communication protocol. The basic functions
provided by the programming executive are:
• Read Memory
• Program Memory
• Blank Check
• Read Executive Firmware Revision
The programming executive performs the low-level
tasks required for erasing, programming and verifying
a device. This allows the programmer to program the
device by issuing the appropriate commands and data.
Table 4-1 provides these commands. For detailed
descriptions of each command, see Section 5.2
“Programming Executive Commands”.
TABLE 4-1:
The programming executive uses the device’s data
RAM for variable storage and program execution. After
the programming executive is run, no assumptions
should be made about the contents of the data RAM.
© 2008 Microchip Technology Inc.
SCHECK
READC
READD
READP
PROGC
PROGD
PROGP
QBLANK
QVER
Command
device)
DEVICE PROGRAMMING –
ENHANCED ICSP
Sanity check.
Read Device ID registers.
Read data EEPROM memory.
Read Code register.
Write User ID.
Program and verify one word of data
EEPROM memory.
Program and verify one row of code
memory or one Configuration register.
Query if the code memory is blank.
Query the software version.
COMMAND SET SUMMARY
to
program
Description
and
verify
Advance Information
the
4.1
Figure 4-1 illustrates the high-level overview of the
programming process.
Perform the following steps:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Steps 7 and 9 ensure that the programming was
successful.
After the programming executive is verified in memory
(or loaded if not present), the PIC24FXXKAXXX family
can be programmed using the command set provided
in Table 4-1.
FIGURE 4-1:
Enter ICSP mode.
Erase the device.
Verify the programming executive.
Exit ICSP mode.
Enter Enhanced ICSP mode.
Program the code memory.
Verify the code memory.
Program the Configuration registers.
Verify the Configuration registers.
PIC24FXXKAXXX
Overview of the Programming
Process
Enter Enhanced ICSP Mode
Exit Enhanced ICSP Mode
Data EEPROM Memory
HIGH-LEVEL ENHANCED
ICSP™ PROGRAMMING FLOW
Program and Verify
Program and Verify
Program and Verify
Enter ICSP™ Mode
Configuration Bits
Exit ICSP Mode
Code Memory
Perform Chip
Erase
Start
End
DS39919A-page 23