PIC24F16KA102-I/SS Microchip Technology, PIC24F16KA102-I/SS Datasheet - Page 8

IC PIC MCU FLASH 16K 28-SSOP

PIC24F16KA102-I/SS

Manufacturer Part Number
PIC24F16KA102-I/SS
Description
IC PIC MCU FLASH 16K 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr

Specifications of PIC24F16KA102-I/SS

Program Memory Type
FLASH
Program Memory Size
16KB (5.5K x 24)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
512 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24F
Core
PIC
Data Bus Width
16 bit
Data Ram Size
1.5 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
9-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA240017 - MODULE PLUG-IN PIC24F16KA102 PIM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24F16KA102-I/SS
Manufacturer:
MICRCOHI
Quantity:
20 000
PIC24F16KA102 FAMILY
3. Module: Electrical Specifications
TABLE 29-6:
4. Module: Electrical Specifications
DS80473F-page 8
DC CHARACTERISTICS
I
DC20
DS20a
DC20b
DC20c
DC20d
DC20e
DC20f
DC20g
Note 1:
DD
Parameter No.
Current
In Table 29-6, the values for parameters, DC20d
and DC20e (I
The
(changes in bold).
In Table 29-8, the typical values for the Watch-
dog Timer Current at 1.8V and all temperatures
(parameters D61 through D61C) are changed to
0.55 A.
2:
corrected
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Operating Parameters:
• EC mode with clock input driven with a square wave rail-to-rail
• I/O configured as outputs driven low
• MCLR – V
• WDT FSCM disabled
• SRAM, program and data memory active
• All PMD bits set except for modules being measured
(DC Specifications)
(DC Specifications)
DD
DC CHARACTERISTICS: OPERATING CURRENT (I
Typical
for Deep Sleep), have changed.
195
365
values
DD
(1)
are
Max
330
330
330
330
590
590
645
720
shown
Standard Operating Conditions: 1.8V to 3.6V (unless otherwise stated)
Operating temperature
Units
below
A
A
+25°C
+60°C
+85°C
+25°C
+60°C
+85°C
-40°C
-40°C
5. Module: Electrical Specifications
In Table 29-8, footnote 2 includes the text: “All
I/Os are configured as inputs and pulled
high….”. This is changed to read as, “All I/Os are
configured as outputs and set low….”.
-40°C  T
A
DD
(DC Specifications)
 +85°C for Industrial
)
Conditions
1.8V
3.3V
 2010 Microchip Technology Inc.
F
OSC
0.5 MIPS,
= 1 MHz

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