ATMEGA8A-PU Atmel, ATMEGA8A-PU Datasheet - Page 2

• Manufacturer Part Number: ATMEGA8A-PU
• Description: MCU AVR 8K FLASH 16MHZ 28-PDIP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA8A-PU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 512 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Processor Series: ATMEGA8x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPI, TWI, USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Package: 28PDIP
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 3.3|5 V
• Controller Family/series: AVR MEGA
• No. Of I/o's: 23
• Eeprom Memory Size: 512Byte
• Ram Memory Size: 1KB
• Cpu Speed: 16MHz
• Rohs Compliant: Yes
• For Use With: ATSTK600 - DEV KIT FOR AVR/AVR32ATSTK500 - PROGRAMMER AVR STARTER KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1. Pin Configurations
8159D–AVR–02/11
Figure 1-1.
Pinout ATmega8A
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XCK/T0) PD4
(XCK/T0) PD4
(INT1) PD3
(INT1) PD3
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
GND
GND
GND
GND
VCC
VCC
VCC
VCC
(XCK/T0) PD4
(RESET) PC6
(AIN0) PD6
(AIN1) PD7
(INT0) PD2
(INT1) PD3
(ICP1) PB0
(RXD) PD0
(TXD) PD1
(T1) PD5
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
GND
VCC
TQFP Top View
MLF Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PDIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PC5 (ADC5/SCL)
PC4 (ADC4/SDA)
PC3 (ADC3)
PC2 (ADC2)
PC1 (ADC1)
PC0 (ADC0)
GND
AREF
AVCC
PB5 (SCK)
PB4 (MISO)
PB3 (MOSI/OC2)
PB2 (SS/OC1B)
PB1 (OC1A)
24
23
22
21
20
19
18
17
24
23
22
21
20
19
18
17
NOTE:
The large center pad underneath the MLF
packages is made of metal and internally
connected to GND. It should be soldered
or glued to the PCB to ensure good
mechanical stability. If the center pad is
left unconneted, the package might
loosen from the PCB.
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
ATmega8A
2