ATMEGA8515-16PU Atmel, ATMEGA8515-16PU Datasheet - Page 2

• Manufacturer Part Number: ATMEGA8515-16PU
• Description: IC AVR MCU 8K 16MHZ 5V 40DIP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA8515-16PU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Cpu Speed: 16 MIPS
• Eeprom Memory: 512 Bytes
• Input Output: 35
• Interface: SPI/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 40-pin PDIP
• Programmable Memory: 8K Bytes
• Timers: 1-8-bit, 1-16-bit
• Voltage, Range: 4.5-5.5 V
• Processor Series: ATMEGA8x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SPI, USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 2
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• For Use With: ATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK500 - PROGRAMMER AVR STARTER KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Pin Configurations
Figure 1. Pinout ATmega8515
2
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
(RXD) PD0
(INT0) PD2
(INT1) PD3
(XCK) PD4
(SCK) PB7
(TXD) PD1
RESET
NC*
ATmega8515(L)
1
2
3
4
5
6
7
8
9
10
11
TQFP/MLF
33
32
31
30
29
28
27
26
25
24
23
(OC0/T0) PB0
NOTES:
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
NC*
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)
(AIN0) PB2
(AIN1) PB3
(INT0) PD2
(INT1) PD3
(RXD) PD0
(SCK) PB7
(TDX) PD1
(XCK) PD4
(WR) PD6
(RD) PD7
(SS) PB4
(T1) PB1
RESET
XTAL2
XTAL1
1. MLF bottom pad should be soldered to ground.
2. * NC = Do not connect (May be used in future devices)
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PDIP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
(INT0) PD2
(INT1) PD3
(RXD) PD0
(XCK) PD4
(SCK) PB7
(TXD) PD1
RESET
NC*
7
8
9
10
11
12
13
14
15
16
17
PLCC
39
38
37
36
35
34
33
32
31
30
29
2512JS–AVR–10/06
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
NC*
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)