DSPIC30F4011-20E/PT Microchip Technology, DSPIC30F4011-20E/PT Datasheet - Page 223

IC DSPIC MCU/DSP 48K 44TQFP

DSPIC30F4011-20E/PT

Manufacturer Part Number
DSPIC30F4011-20E/PT
Description
IC DSPIC MCU/DSP 48K 44TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F4011-20E/PT

Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
44-TQFP, 44-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
1024 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
44TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
9-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401120EPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4011-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4011-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2010 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
A2
1.980
dsPIC30F4011/4012
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
DS70135G-page 223
c

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