ATMEGA644A-PU Atmel, ATMEGA644A-PU Datasheet - Page 286

IC MCU AVR 64K FLASH 40PDIP

ATMEGA644A-PU

Manufacturer Part Number
ATMEGA644A-PU
Description
IC MCU AVR 64K FLASH 40PDIP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA644A-PU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
ATmega
Core
AVR
Data Bus Width
8 bit
Data Ram Size
4 KB
Interface Type
JTAG, TWI, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
25.8.11
25.8.12
8272A–AVR–01/10
Preventing Flash Corruption
Programming Time for Flash when Using SPM
SPMCSR, the signature byte value will be loaded in the destination register. The SIGRD and
SPMEN bits will auto-clear upon completion of reading the Signature Row Lock bits or if no LPM
instruction is executed within three CPU cycles. When SIGRD and SPMEN are cleared, LPM will
work as described in the Instruction set Manual.
Table 25-5.
Note:
During periods of low V
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
1. If there is no need for a Boot Loader update in the system, program the Boot Loader Lock
2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.
3. Keep the AVR core in Power-down sleep mode during periods of low V
The calibrated RC Oscillator is used to time Flash accesses.
typical programming time for Flash accesses from the CPU.
Table 25-6.
Note:
164A/164PA/324A/324PA/644A/644PA/1284/1284P
Signature Byte
Device Signature Byte 1
Device Signature Byte 2
Device Signature Byte 3
RC Oscillator Calibration Byte
Flash write (Page Erase, Page Write, and
write Lock bits by SPM)
bits to prevent any Boot Loader software updates.
This can be done by enabling the internal Brown-out Detector (BOD) if the operating volt-
age matches the detection level. If not, an external low V
used. If a reset occurs while a write operation is in progress, the write operation will be
completed provided that the power supply voltage is sufficient.
vent the CPU from attempting to decode and execute instructions, effectively protecting
the SPMCSR Register and thus the Flash from unintentional writes.
All other addresses are reserved for future use.
1. Minimum and maximum programming times is per individual operation.
Signature Row Addressing
SPM Programming Time
Symbol
CC
, the Flash program can be corrupted because the supply voltage is
(1)
Min Programming Time
Z-Pointer Address
0x0000
0x0002
0x0004
0x0001
3.7 ms
CC
Table 25-6 on page 286
reset protection circuit can be
Max Programming Time
CC
. This will pre-
4.5 ms
shows the
286

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