LPC2103FBD48,118 NXP Semiconductors, LPC2103FBD48,118 Datasheet - Page 22

IC ARM7 MCU FLASH 32K 48-LQFP

LPC2103FBD48,118

Manufacturer Part Number
LPC2103FBD48,118
Description
IC ARM7 MCU FLASH 32K 48-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet

Specifications of LPC2103FBD48,118

Core Processor
ARM7
Core Size
16/32-Bit
Speed
70MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, JTAG, SPI, SSP, UART
Maximum Clock Frequency
70 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
Development Tools By Supplier
OM10079, OM10081, OM10090
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
568-4302 - BOARD EVAL LPC210X KS2103 JLINK568-4301 - BOARD EVAL LPC210X KS2103568-4300 - BOARD EVAL LPC210X MCB2103568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2622-1013 - BOARD FOR LPC2103 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSONMCB2103 - BOARD EVAL NXP LPC2101/2101/2103
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
935280966118
LPC2103FBD48-T
LPC2103FBD48-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2103FBD48,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
7. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Per ground pin.
[11] Dependent on package type.
[12] Performed per AEC-Q100-002.
[13] Performed per AEC-Q100-003.
[14] Performed per AEC-Q100-011.
LPC2101_02_03_4
Product data sheet
Symbol
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(1V8)
DD(3V3)
DDA
i(VBAT)
IA
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Core and internal rail.
External rail.
On ADC related pins.
Including voltage on outputs in 3-state mode.
Only valid when the V
Not to exceed 4.6 V.
Per supply pin.
The peak current is limited to 25 times the corresponding maximum current.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (1.8 V)
supply voltage (3.3 V)
analog 3.3 V pad supply voltage
input voltage on pin VBAT
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation (per package)
electrostatic discharge voltage
DD(3V3)
supply voltage is present.
Rev. 04 — 2 June 2009
Conditions
for the RTC
5 V tolerant I/O
pins
other I/O pins
based on package
heat transfer, not
device power
consumption
Human Body
Model (HBM)
Machine Model
(MM)
Charged Device
Model (CDM)
[1]
Single-chip 16-bit/32-bit microcontrollers
[5][6]
[10]
[11]
[2]
[3]
[4]
[5]
[8]
Min
-
-
-
0.5
0.5
0.5
0.5
0.5
0.5
0.5
65
4000
200
800
LPC2101/02/03
Max
+2.5
+4.6
+4.6
+4.6
+5.1
+6.0
V
100
100
+150
1.5
+4000
+200
+800
DD
[9]
[9]
+ 0.5
© NXP B.V. 2009. All rights reserved.
[7]
SS
Unit
V
V
V
V
V
V
V
mA
mA
W
V
V
V
C
unless
[12]
[13]
[14]
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