LPC2103FBD48,118 NXP Semiconductors, LPC2103FBD48,118 Datasheet - Page 35

• Manufacturer Part Number: LPC2103FBD48,118
• Description: IC ARM7 MCU FLASH 32K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2103FBD48,118

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, JTAG, SPI, SSP, UART
• Maximum Clock Frequency: 70 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
• Development Tools By Supplier: OM10079, OM10081, OM10090
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 568-4302 - BOARD EVAL LPC210X KS2103 JLINK568-4301 - BOARD EVAL LPC210X KS2103568-4300 - BOARD EVAL LPC210X MCB2103568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2622-1013 - BOARD FOR LPC2103 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSONMCB2103 - BOARD EVAL NXP LPC2101/2101/2103
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 935280966118; LPC2103FBD48-T; LPC2103FBD48-T

NXP Semiconductors
13. Revision history
Table 9.
LPC2101_02_03_4
Product data sheet
Document ID
LPC2101_02_03_4
Modifications:
LPC2101_02_03_3
Modifications:
LPC2101_02_03_2
LPC2101_02_03_1
Revision history
Release date
20090602
20081007
20071218
20060118
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Section 6.17.4 “Code security (Code Read Protection -
CRP levels (applicable to Revision A and higher).
Section 6.17.7 “Power
Revision A and higher).
Section 10.1 “XTAL1 input”
Section 10.2 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines”
Figure
(applicable to Revision A and higher).
Table
Table
pins.
Table
Table
Table
Updated data sheet status to Product data sheet.
Table 1 and Table 2: added LPC2102FHN48 and LPC2103FHN48.
Table 1, Table 2, Table 3 and related figures: removed LPC2103FA44.
Table 3: updated pad descriptions.
Table 3: updated description of pin 47, SCL1.
Table 3: updated description of pins V
Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.
Table 5: added or modified values for I
Table 5: removed “CCLK = 10 MHz” and associated values for I
Section 5: added Figure 3.
Section 11: added Figure 11.
3: added table note 7.
3: modified description of P0.14, RTCX1, RTCX2, XTAL1, XTAL2, JTAG, and DBGSEL
4: modified value for V
5: added and modified values for V
5: Voltage range for pins V
6,
Figure
Data sheet status
Product data sheet
Product data sheet
Preliminary data sheet
Preliminary data sheet
7,
Figure
Rev. 04 — 2 June 2009
control”: added description of Deep power-down mode (applicable to
8: added power consumption data for Deep power-down mode
added.
DD(3V3)
DD(3V3)
.
DDA
DD(act)
and V
hys
and V
.
, I
Single-chip 16-bit/32-bit microcontrollers
Change
notice
DDA
-
-
-
DD(pd)
DD(1V8)
extended to 2.6 V.
, I
BATpd
.
CRP)”: added description of three
LPC2101/02/03
, I
BATact
Supersedes
LPC2101_02_03_3
LPC2101_02_03_2
LPC2101_02_03_1
-
DD(act)
.
.
© NXP B.V. 2009. All rights reserved.
added.
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