LPC2420FBD208,551 NXP Semiconductors, LPC2420FBD208,551 Datasheet - Page 75

IC ARM7 MCU ROMLESS 208LQFP

LPC2420FBD208,551

Manufacturer Part Number
LPC2420FBD208,551
Description
IC ARM7 MCU ROMLESS 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheet

Specifications of LPC2420FBD208,551

Program Memory Type
ROMless
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
82K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
82 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4527
935286745551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2420FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
16. Revision history
Table 15.
LPC2420_60_5
Preliminary data sheet
Document ID
LPC2420_60_5
Modifications:
LPC2420_60_4
Modifications:
LPC2420_60_3
LPC2460_2
LPC2460_1
Revision history
Release date
20100224
20091015
20081120
20080201
20080123
Table
Table
Added
Added LPC2420FET208.
Added Deep power-down mode information.
Table 6: Changed ESD min/max to −2500/+2500.
Table 7: Updated conditions and typical values for I
Table 7: Updated Table note 13.
Table 7: Updated min, typical and max values for oscillator pins.
Added Section 13.2 “XTAL1 input”.
Added Section 13.3 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines”.
Figure 21: Changed ISP1301 to ISP1302.
Figure 22: Changed ISP1301 to ISP1302.
Section 7.25.3 “Brownout detection”: Changed V
7: Merged power-down mode information into one table.
7: Changed typical values from 19 to 20 for I
Table 13 “DAC electrical
Data sheet status
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Rev. 05 — 24 February 2010
characteristics”.
Change notice
-
-
-
-
-
Flashless 16-bit/32-bit microcontroller
DD(3V3)
DD(DCDC)dpd(3V3)
DD(DCDC)act(3V3)
to V
LPC2420/2460
DD(DCDC)(3V3)
Supersedes
LPC2420_60_4
LPC2420_60_3
LPC2460_2
LPC2460_1
-
, I
.
BATact
© NXP B.V. 2010. All rights reserved.
.
, and I
BAT
.
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