LPC2420FBD208,551 NXP Semiconductors, LPC2420FBD208,551 Datasheet - Page 75
LPC2420FBD208,551
Manufacturer Part Number
LPC2420FBD208,551
Description
IC ARM7 MCU ROMLESS 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheet
1.LPC2460FBD208551.pdf
(79 pages)
Specifications of LPC2420FBD208,551
Program Memory Type
ROMless
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
82K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
82 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4527
935286745551
935286745551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2420FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
16. Revision history
Table 15.
LPC2420_60_5
Preliminary data sheet
Document ID
LPC2420_60_5
Modifications:
LPC2420_60_4
Modifications:
LPC2420_60_3
LPC2460_2
LPC2460_1
Revision history
Release date
20100224
20091015
20081120
20080201
20080123
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Table
Table
Added
Added LPC2420FET208.
Added Deep power-down mode information.
Table 6: Changed ESD min/max to −2500/+2500.
Table 7: Updated conditions and typical values for I
Table 7: Updated Table note 13.
Table 7: Updated min, typical and max values for oscillator pins.
Added Section 13.2 “XTAL1 input”.
Added Section 13.3 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines”.
Figure 21: Changed ISP1301 to ISP1302.
Figure 22: Changed ISP1301 to ISP1302.
Section 7.25.3 “Brownout detection”: Changed V
7: Merged power-down mode information into one table.
7: Changed typical values from 19 to 20 for I
Table 13 “DAC electrical
Data sheet status
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Preliminary data sheet
Rev. 05 — 24 February 2010
characteristics”.
Change notice
-
-
-
-
-
Flashless 16-bit/32-bit microcontroller
DD(3V3)
DD(DCDC)dpd(3V3)
DD(DCDC)act(3V3)
to V
LPC2420/2460
DD(DCDC)(3V3)
Supersedes
LPC2420_60_4
LPC2420_60_3
LPC2460_2
LPC2460_1
-
, I
.
BATact
© NXP B.V. 2010. All rights reserved.
.
, and I
BAT
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