LPC1768FBD100,551 NXP Semiconductors, LPC1768FBD100,551 Datasheet - Page 2

IC ARM CORTEX MCU 512K 100-LQFP

LPC1768FBD100,551

Manufacturer Part Number
LPC1768FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1768FBD100,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME, IRD-LPC1768-DEV, KSK-LPC1768-JL
Development Tools By Supplier
OM11032, OM11033, OM11034, OM11035, OM11043
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Package
100LQFP
Device Core
ARM Cortex M3
Family Name
LPC17xx
Maximum Speed
100 MHz
Cpu Family
LPC17xx
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4916 - DEVELOPMENT BOARD LPC1768 MBED568-4816 - EVAL BOARD FOR MCB1768568-4815 - KIT EVAL LPC1768 CR622-1032 - KIT DEV IND REF DESIGN LPC1768622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4796
935288608551

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NXP Semiconductors
LPC1769_68_67_66_65_64_63
Product data sheet
Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with SSP, I
Digital-to-Analog converter peripherals, timer match signals, and for
memory-to-memory transfers.
Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and
the USB interface. This interconnect provides communication with no arbitration
delays.
Split APB bus allows high throughput with few stalls between the CPU and DMA.
Serial interfaces:
Other peripherals:
Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as
for general purpose CPU instruction and data storage.
Ethernet MAC with RMII interface and dedicated DMA controller. (Not available on
all parts, see
USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and
on-chip PHY for device, Host, and OTG functions. (Not available on all parts, see
Table
Four UARTs with fractional baud rate generation, internal FIFO, and DMA support.
One UART has modem control I/O and RS-485/EIA-485 support, and one UART
has IrDA support.
CAN 2.0B controller with two channels. (Not available on all parts, see
SPI controller with synchronous, serial, full duplex communication and
programmable data length.
Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces
can be used with the GPDMA controller.
Three enhanced I
I
port pins. Enhancements include multiple address recognition and monitor mode.
I
control. The I
supports 3-wire and 4-wire data transmit and receive as well as master clock
input/output. (Not available on all parts, see
70 (100 pin package) General Purpose I/O (GPIO) pins with configurable
pull-up/down resistors. All GPIOs support a new, configurable open-drain operating
mode. The GPIO block is accessed through the AHB multilayer bus for fast access
and located in memory such that it supports Cortex-M3 bit banding and use by the
General Purpose DMA Controller.
12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA
support. (Not available on all parts, see
Four general purpose timers/counters, with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
One motor control PWM with support for three-phase motor control.
2
2
C specification and Fast mode plus with data rates of 1 Mbit/s, two with standard
S (Inter-IC Sound) interface for digital audio input or output, with fractional rate
2.)
All information provided in this document is subject to legal disclaimers.
2
Table
S-bus interface can be used with the GPDMA. The I
Rev. 6.01 — 11 March 2011
2
C bus interfaces, one with an open-drain output supporting full
2.)
LPC1769/68/67/66/65/64/63
2
S-bus, UART, Analog-to-Digital and
Table
32-bit ARM Cortex-M3 microcontroller
Table
2)
2.)
© NXP B.V. 2011. All rights reserved.
2
S-bus interface
Table
2.)
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