LPC2468FET208,551 NXP Semiconductors, LPC2468FET208,551 Datasheet - Page 6

• Manufacturer Part Number: LPC2468FET208,551
• Description: IC ARM7 MCU FLASH 512K 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4262; 935283234551; LPC2468FET208-S

NXP Semiconductors
4. Applications
5. Ordering options
Table 3.
Table 4.
Table 5.
UM10237_4
User manual
Type number
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Type number
LPC2458FET180
Type number
LPC2420FBD208 LQFP208
LPC2460FBD208 LQFP208
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 × 0.7 mm SOT950-1
LPC2458 ordering information
LPC2458 ordering options
LPC2420/60 ordering information
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Package
Name
Package
Name
Flash
(kB)
512
•
•
•
•
•
•
Boundary scan for simplified board testing.
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
Industrial control
Medical systems
Protocol converter
Communications
64 16 16 2
Description
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SRAM (kB)
98 16-bit
Rev. 04 — 26 August 2009
External
bus
Ethernet
MII/
RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
2
SD/
MMC
yes
GP
DMA
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
1
Version
Version
SOT459-1
SOT459-1
Temp
range
−40 °C to
+85 °C
6 of 792