LPC2468FET208,551 NXP Semiconductors, LPC2468FET208,551 Datasheet - Page 660

• Manufacturer Part Number: LPC2468FET208,551
• Description: IC ARM7 MCU FLASH 512K 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4262; 935283234551; LPC2468FET208-S

NXP Semiconductors
8. Battery RAM
9. RTC external 32 kHz oscillator component selection
UM10237_4
User manual
power consumption by using the signal from RTCX1-2 pins, and writing a 0 into the
PCRTC bit in the PCONP power control register (see
page
Remark: Note that if the RTC is running from the 32 kHz signal and powered by VBAT, the
internal registers can be read. However, they cannot be written to unless the PCRTC bit in
the PCONP register is set to 1, see
The Battery RAM is a 2 kbyte static RAM residing on the APB bus. The address range is
0xE008 4000 to 0xE008 47FF.The SRAM can be accessed word-wise (32-bit) only.
The Battery RAM is powered from the VBAT pin along with the RTC, both of which exist in
a power domain that is isolated from the rest of the chip. This allows them to operate while
the main chip power has been removed.
The RTC external oscillator circuit is shown in
resistance is integrated on chip, only a crystal, the capacitances C
connected externally to the microcontroller.
Table 26–583
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in
Table 26–583
C
C
Fig 136. RTC 32 kHz crystal oscillator circuit
L
X2
L
. Parasitics from PCB and package are not taken into account.
influences oscillation frequency. When using a crystal that is manufactured for a
specified in this table are calculated from the internal parasitic capacitances and the
60).
gives the crystal parameters that should be used. C
that belong to a specific C
Rev. 04 — 26 August 2009
Chapter 26: LPC24XX Real-Time Clock (RTC) and battery RAM
C
X1
RTCX1
Table
L
LPC24xx
. The value of external capacitances C
4–63.
32 kHz
Xtal
Figure
RTCX2
26–136. Since the feedback
Section 4–3.4 “Power control” on
C
X2
L
X1
is the typical load
and C
UM10237
© NXP B.V. 2009. All rights reserved.
X2
need to be
X1
660 of 792
and