LPC2468FET208,551 NXP Semiconductors, LPC2468FET208,551 Datasheet - Page 692

• Manufacturer Part Number: LPC2468FET208,551
• Description: IC ARM7 MCU FLASH 512K 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4262; 935283234551; LPC2468FET208-S

NXP Semiconductors
UM10237_4
User manual
10.1 Prepare sector(s) for write operation
As per the ARM specification (The ARM Thumb Procedure Call Standard SWS ESPC
0002 A-05) up to 4 parameters can be passed in the r0, r1, r2 and r3 registers
respectively. Additional parameters are passed on the stack. Up to 4 parameters can be
returned in the r0, r1, r2 and r3 registers respectively. Additional parameters are returned
indirectly via memory. Some of the IAP calls require more than 4 parameters. If the ARM
suggested scheme is used for the parameter passing/returning then it might create
problems due to difference in the C compiler implementation from different vendors. The
suggested parameter passing scheme reduces such risk.
The Flash memory is not accessible during a write or erase operation. IAP commands,
which results in a Flash write/erase operation, use 32 bytes of space in the top portion of
the on-chip RAM for execution. The user program should not be use this space if IAP
Flash programming is permitted in the application.
Table 620. IAP Command Summary
This command makes Flash write/erase operation a two step process.
IAP Command
Prepare sector(s) for write operation
Copy RAM to Flash
Erase sector(s)
Blank check sector(s)
Read Part ID
Read Boot code version
Compare
Reinvoke ISP
Fig 140. IAP parameter passing
ARM REGISTER r0
ARM REGISTER r1
Rev. 04 — 26 August 2009
Chapter 30: LPC24XX Flash memory programming firmware
Command Code
50
51
52
53
54
55
56
57
10
10
10
10
10
10
10
10
COMMAND CODE
PARAMETER 1
PARAMETER 2
PARAMETER n
STATUS CODE
RESULT 1
RESULT 2
RESULT n
Described in
Table 30–621
Table 30–622
Table 30–623
Table 30–624
Table 30–625
Table 30–626
Table 30–627
Table 30–628
UM10237
command
parameter table
command
result table
© NXP B.V. 2009. All rights reserved.
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