LPC2468FET208,551 NXP Semiconductors, LPC2468FET208,551 Datasheet - Page 8

• Manufacturer Part Number: LPC2468FET208,551
• Description: IC ARM7 MCU FLASH 512K 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4262; 935283234551; LPC2468FET208-S

NXP Semiconductors
Table 10.
Table 11.
Table 12.
6. Architectural overview
UM10237_4
User manual
Type number
LPC2470FBD208 N/A
LPC2470FET208
Type number
LPC2478FBD208 LQFP208
LPC2478FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
Type number
LPC2478FBD208 512
LPC2478FET208
LPC2470 ordering options
LPC2478 ordering information
LPC2478 ordering options
5.5 LPC2478 ordering options
Package
Name
Flash
(kB)
N/A
Flash
(kB)
512
The LPC2400 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2400 implements two AHB buses in order to allow the Ethernet block to operate
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
64
64
64
64
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
0.7 mm
16
16
16
16
SRAM (kB)
SRAM (kB)
16
16
16
16
2
2
2
2
Rev. 04 — 26 August 2009
98 Full
98 Full
98 Full
98 Full
External
bus
32-bit
32-bit
External
bus
32-bit
32-bit
Ethernet USB
MII/RMII
MII/RMII
Ethernet USB
MII/RMII
MII/RMII
Chapter 1: LPC24XX Introductory information
OTG/
OHC/
Device
+ 4 kB
FIFO
yes
yes
OTG/
OHC/
Device
+ 4 kB
FIFO
yes
yes
2
2
2
2
SD/
MMC
yes
yes
SD/
MMC
yes
yes
GP
DMA
yes
yes
GP
DMA
yes
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
8
8
8
1
1
1
1
Version
SOT459-1
SOT950-1
Temp
range
−40 °C
to
+85 °C
−40 °C
to
+85 °C
Temp
range
−40 °C
to
+85 °C
−40 °C
to
+85 °C
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