STM8S105K4T6CTR STMicroelectronics, STM8S105K4T6CTR Datasheet - Page 114

• Manufacturer Part Number: STM8S105K4T6CTR
• Description: MCU 8BIT 16K FLASH 32-LQFP
• Manufacturer: STMicroelectronics
• Series: STM8Sr

Specifications of STM8S105K4T6CTR

• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.95 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Processor Series: STM8S10x
• Core: STM8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, UART, IrDA, LIN, SPI
• Number Of Programmable I/os: 25
• Number Of Timers: 7
• Operating Supply Voltage: 2.95 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWSTM8
• Development Tools By Supplier: STICE-SYS001
• Minimum Operating Temperature: - 40 C
• For Use With: 497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal characteristics
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Thermal characteristics
The maximum chip junction temperature (T
Operating conditions
The maximum chip-junction temperature, T
the following equation:
T
Where:
•
•
•
•
•
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural convection
(still air). Available from www.jedec.org.
Symbol
Θ
Θ
Θ
Θ
Jmax
JA
JA
JA
JA
T
Θ
P
P
power.
P
+ Σ((V
and high level in the application.
convection environment.
Amax
I/Omax
Dmax
INTmax
JA
= T
is the package junction-to-ambient thermal resistance in ° C/W
Amax
is the maximum ambient temperature in °C
DD
is the sum of P
represents the maximum power dissipation on output pinsWhere:P
is the product of I
-V
OH)
+ (P
Parameter
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 44 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
Thermal resistance junction-ambient
VQFPN 32 - 5 x 5 mm
*I
Dmax
OH
), taking into account the actual V
x Θ
INTmax
Table 58: Thermal characteristics
JA
DD
)
DocID14771 Rev 10
andV
and P
DD
I/Omax
, expressed in Watts. This is the maximum chip internal
Jmax
J max
(P
Dmax
, in degrees Celsius, may be calculated using
) must never exceed the values given in
= P
INTmax
OL
/I
OL and
+ P
(1)
I/Omax
V
Value
57
54
60
22
OH
/I
)
OH
of the I/Os at low
I/Omax
STM8S105xx
=Σ (V
Unit
°C/W
°C/W
°C/W
°C/W
OL
*I
OL
)