STM32F101T6U6A STMicroelectronics, STM32F101T6U6A Datasheet - Page 14

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STM32F101T6U6A

Manufacturer Part Number
STM32F101T6U6A
Description
MCU ARM 32BIT 32KB FLASH 36VFQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101T6U6A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN, 36-VFQFPN
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
6 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
26
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Description
2.2
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Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
referred to as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, and the STM32F101xC, STM32F101xD and STM32F101xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F101x8/B devices, they are
specified in the STM32F101x4/6 and STM32F101xC/D/E datasheets, respectively. Low-
density devices feature lower Flash memory and RAM capacities and a timer less. High-
density devices have higher Flash memory and RAM capacities, and additional peripherals
like FSMC and DAC, while remaining fully compatible with the other members of the
STM32F101xx family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD and STM32F101xE
are a drop-in replacement for the STM32F101x8/B medium-density devices, allowing the
user to try different memory densities and providing a greater degree of freedom during the
development cycle.
Moreover, the STM32F101xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the
Pinout
144
100
64
48
36
reference datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
1 × ADC
Low-density devices
16 KB
Flash
STM32F101xx family
2
Flash
C
32 KB
(1)
Doc ID 15058 Rev 5
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
1 × ADC
Medium-density devices
64 KB
Flash
Memory size
128 KB
Flash
5 × USARTs
4 × 16-bit timers, 2 × basic timers
3 × SPIs, 2 × I
2 × DACs, FSMC (100 and 144 pins)
256 KB
32 KB
Flash
RAM
STM32F101x4, STM32F101x6
High-density devices
2
384 KB
Cs, 1 × ADC,
48 KB
Flash
RAM
512 KB
48 KB
Flash
RAM

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