STM32F101T6U6A STMicroelectronics, STM32F101T6U6A Datasheet - Page 66

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STM32F101T6U6A

Manufacturer Part Number
STM32F101T6U6A
Description
MCU ARM 32BIT 32KB FLASH 36VFQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101T6U6A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN, 36-VFQFPN
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
6 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
26
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
66/79
Table 45.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterization, not tested in production.
Figure 32. ADC accuracy characteristics
4095
4094
4093
Symbol
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
E
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
O
IDEAL
ADC accuracy
2
=
3
V
4096
Parameter
DDA
4
5
1 LSB
E
6
(1) (2) (3)
T
IDEAL
Doc ID 15058 Rev 5
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
E
PCLK2
ADC
D
DDA
4093 4094 4095 4096
(3)
= 14 MHz, R
= 2.4 V to 3.6 V
= 28 MHz,
Test conditions
DD
(1)
, frequency and temperature ranges.
E
INJ(PIN)
G
V
DDA
AIN
and Σ I
< 10 kΩ,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total u nadjusted er ror: maximum deviation
=Integral linearity error:
=Offset e rror: deviation between the first actual
=Gain er ror: deviation between the last ideal
=Differential linearity error: maximum deviation
STM32F101x4, STM32F101x6
INJ(PIN)
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.12
Max
maximum deviation
±2.5
±3
±2
±5
±3
(4)
does not
ai15497
Unit
LSB

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