STM32F101C8U6 STMicroelectronics, STM32F101C8U6 Datasheet - Page 68

• Manufacturer Part Number: STM32F101C8U6
• Description: MCU 32BIT ARM 128K FLASH 48-QFN
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101C8U6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 37
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP Exposed Pad, 48-eLQFP, 48-HLQFP
• Processor Series: STM32F101x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 10 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: 497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
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Table 45.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterization, not tested in production.
Figure 33. ADC accuracy characteristics
Symbol
4095
4094
4093
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
E
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
IDEAL
O
ADC accuracy
2
=
V
4096
3
REF+
Parameter
4
(or
V
5
1 LSB
4096
DDA
E
(1) (2) (3)
6
T
depending on package)]
IDEAL
Doc ID 13586 Rev 14
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
E
PCLK2
ADC
DDA
D
4093 4094 4095 4096
(3)
= 14 MHz, R
= 2.4 V to 3.6 V
= 28 MHz,
Test conditions
DD
(1)
, frequency, V
E
INJ(PIN)
G
V
AIN
DDA
and ΣI
< 10 kΩ,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
REF
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
STM32F101x8, STM32F101xB
INJ(PIN)
and temperature ranges.
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.12
Max
±2.5
±3
±2
±5
±3
(4)
does not
Unit
LSB
ai14395b