STM32F103C6T7A STMicroelectronics, STM32F103C6T7A Datasheet - Page 13

MCU ARM 32BIT 32KB FLASH 48LQFP

STM32F103C6T7A

Manufacturer Part Number
STM32F103C6T7A
Description
MCU ARM 32BIT 32KB FLASH 48LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F103C6T7A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
48-LQFP
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STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Interface Type
CAN/I2C/SPI/USART
Total Internal Ram Size
10KB
# I/os (max)
37
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
2(10-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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STM32F103x4, STM32F103x6
2.2
Full compatibility throughout the family
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are
identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as
medium-density devices, and the STM32F103xC, STM32F103xD and STM32F103xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F103x8/B devices, they are
specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low-
density devices feature lower Flash memory and RAM capacities, less timers and
peripherals. High-density devices have higher Flash memory and RAM capacities, and
additional peripherals like SDIO, FSMC, I
the other members of the STM32F103xx family.
The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE
are a drop-in replacement for STM32F103x8/B medium-density devices, allowing the user
to try different memory densities and providing a greater degree of freedom during the
development cycle.
Moreover, the STM32F103xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7),
Pinout
144
100
64
48
36
the reference datasheet for electrical characteristics is that of the STM32F103x8/B medium-density
devices.
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
CAN, 1 × PWM timer
2 × ADCs
6 KB RAM 10 KB RAM 20 KB RAM 20 KB RAM 48 KB RAM 64 KB RAM 64 KB RAM
Low-density devices
16 KB
Flash
STM32F103xx family
2
C, USB,
Flash
32 KB
(1)
Doc ID 15060 Rev 5
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I
CAN, 1 × PWM timer
2 × ADCs
Medium-density devices
64 KB
Flash
2
S and DAC, while remaining fully compatible with
2
Cs, USB,
128 KB
Flash
5 × USARTs
4 × 16-bit timers, 2 × basic timers
3 × SPIs, 2 × I
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs, 1 × SDIO
FSMC (100 and 144 pins)
256 KB
Flash
High-density devices
2
Ss, 2 × I2Cs
384 KB
Flash
Description
512 KB
Flash
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