STM32F103C6T7A STMicroelectronics, STM32F103C6T7A Datasheet - Page 53

MCU ARM 32BIT 32KB FLASH 48LQFP

STM32F103C6T7A

Manufacturer Part Number
STM32F103C6T7A
Description
MCU ARM 32BIT 32KB FLASH 48LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F103C6T7A

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
48-LQFP
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Interface Type
CAN/I2C/SPI/USART
Total Internal Ram Size
10KB
# I/os (max)
37
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
2(10-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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STM32F103x4, STM32F103x6
Table 30.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.
Table 31.
V
V
Symbol
Symbol Parameter
FESD
EFTB
S
EMI
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
Peak level V
EMS characteristics
EMI characteristics
DD
Parameter
= 3.3 V, T
Conditions
Doc ID 15060 Rev 5
A
DD
= 25 °C
and V
SS
130 MHz to 1GHz
frequency band
SAE EMI Level
30 to 130 MHz
0.1 to 30 MHz
Monitored
V
f
conforms to IEC 61000-4-2
V
f
conforms to IEC 61000-4-4
HCLK
HCLK
DD
DD
= 3.3 V, T
= 3.3 V, T
= 72 MHz
= 72 MHz
Conditions
A
A
Max vs. [f
8/48 MHz 8/72 MHz
Electrical characteristics
= +25 °C,
= +25 °C,
12
22
23
4
HSE
/f
12
19
29
HCLK
4
]
Level/
Class
dBµV
Unit
2B
4A
53/87
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