STM8S207MBT6B STMicroelectronics, STM8S207MBT6B Datasheet - Page 97

• Manufacturer Part Number: STM8S207MBT6B
• Description: MCU 8BIT 128K MEMORY 80-LQFP
• Manufacturer: STMicroelectronics
• Series: STM8Sr

Specifications of STM8S207MBT6B

• Mfg Application Notes: STM8S Getting Started
• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 2.95 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Processor Series: STM8S20x
• Core: STM8
• Data Bus Width: 8 bit
• Data Ram Size: 6 KB
• Interface Type: CAN, 12C, SPI, UART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 2
• Operating Supply Voltage: 2.95 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWSTM8
• Development Tools By Supplier: STICE-SYS001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• For Use With: 497-10032 - EVAL KIT MOTOR CONTROL STM8S497-10031 - EVAL KIT TOUCH SENSING STM8S497-10592 - BOARD DAUGHTER FOR STM8S207/8497-10593 - KIT STARTER FOR STM8S207/8 SER497-8506 - BOARD EVAL FOR STM8S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8952; STM8S207MBT6B

STM8S207xx, STM8S208xx
11.2
11.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 18: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
T
Where:
●
●
●
●
●
Table 57.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
T

P
P
internal power.
P
P
V
Amax






= T
Dmax
INTmax
I/Omax
I/Omax
OH
JA
JA
JA
JA
JA
JA
JA
/I
is the package junction-to-ambient thermal resistance in C/W
Amax
OH
is the maximum ambient temperature in C
is the sum of P
= (V
represents the maximum power dissipation on output pins, where:
Thermal characteristics
is the product of I
of the I/Os at low and high level in the application.
+ (P
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 44 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
OL
Dmax
*I
OL
x 
) + ((V
INTmax
JA
Doc ID 14733 Rev 11
)
DD
DD
and P
and V
Parameter
-V
OH)
(1)
I/Omax
DD
*I
, expressed in Watts. This is the maximum chip
OH
Jmax
Jmax
), and taking account of the actual V
(P
) must never exceed the values given in
, in degrees Celsius, may be calculated
57.
Dmax
= P
INTmax
+ P
Package characteristics
I/Omax
Value
38
45
46
57
54
60
)
OL
/I
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
OL
Unit
97/105
and