STM32F101VCT6 STMicroelectronics, STM32F101VCT6 Datasheet - Page 90

• Manufacturer Part Number: STM32F101VCT6
• Description: MCU ARM 32BIT 256K FLASH 100LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101VCT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F101x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STM3210E-EVAL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• A/d Bit Size: 12 bit
• A/d Channels Available: 16
• Height: 1.4 mm
• Length: 14 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2 V
• Width: 14 mm
• For Use With: 497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
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Figure 46. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 47. Power supply and reference decoupling (V
1. V
pad capacitance (roughly 7 pF). A high C
this, f
REF+
parasitic
ADC
and V
Table 53
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
V AIN
REF-
1 µF // 10 nF
inputs are available only on 100-pin packages.
for the values of R
R AIN (1)
REF+
C parasitic
AINx
is connected to V
Doc ID 14610 Rev 7
AIN
1 µF // 10 nF
, R
parasitic
ADC
V DD
and C
0.6 V
0.6 V
value will downgrade conversion accuracy. To remedy
V T
V T
STM32F101xC, STM32F101xD, STM32F101xE
ADC
DDA
.
I L ±1 µA
or not. The 10 nF capacitors should be
V REF+
V DDA
V SSA /V REF-
STM32F10xxx
Sample and hold ADC
converter
R ADC (1)
REF+
Figure 47
not connected to
C ADC (1)
converter
12-bit
STM32F10xxx
or
Figure
ai14380b
48,
V
ai14139d
DDA
)