STM32F101VDT6 STMicroelectronics, STM32F101VDT6 Datasheet - Page 102

MCU ARM 32BIT 384K FLASH 100LQFP

STM32F101VDT6

Manufacturer Part Number
STM32F101VDT6
Description
MCU ARM 32BIT 384K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101VDT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM3210E-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Revision history
8
102/106
Revision history
Table 65.
22-May-2008
07-Apr-2008
21-Jul-2008
Date
Document revision history
Revision
1
2
3
Initial release.
Document status promoted from Target Specification to Preliminary
Data.
Section 1: Introduction
the family
Note 1
STM32F101xE features and peripheral counts on page
LQPF100/BGA100 column added to
page
Values added to
Table
Values added to
Table 19
Figure 15
Standby mode
Figure 53: Recommended footprint(1) on page 96
Equation 1
temperature for an application on page 100
Document status promoted from Preliminary Data to full datasheet.
FSMC (flexible static memory controller) on page 15
Power supply supervisor on page 17
Table 10: General operating conditions on page
Table notes revised in
Capacitance modified in
Table 51: SCL frequency (fPCLK1= 36 MHz, VDD = 3.3 V)
Table 52: SPI characteristics
SPI timing diagram - slave mode and CPHA=0 on page
Minimum SDA and SCL fall time value for Fast mode removed from
Table 50: I2C characteristics on page
I
consumptions in Stop and Standby modes on page
Table 30: Flash memory endurance and data retention on page 56
updated.
f
t
EO corrected in
in
accuracy.
Figure 46: Typical connection diagram using the ADC on page 90
note below corrected.
Typical T
page
Section 6.1: Package mechanical data on page 94
Small text changes.
DD_VBAT
HCLK
su(NSS)
Table 55: ADC accuracy - limited test conditions
Doc ID 14610 Rev 7
31.
93.
14,
corrected in
added in
modified in
S_temp
and
values added to
Table
modified. Small text changes.
and
corrected.
Table 20
Figure
removed.
15,
value removed from
Table 56: ADC accuracy on page
Typical current consumption on page 46
Table 2: STM32F101xC, STM32F101xD and
Maximum current consumption on page 40
STM32F101xC, STM32F101xD, STM32F101xE
Table 41: EMS
Table 16
Table 52: SPI
16).
Section 6.2.2: Evaluating the maximum junction
Section 5: Electrical
and see
and
Figure 9: Power supply scheme on page
Table 17: Typical and maximum current
Table 19: Typical current consumption in
Section 2.2: Full compatibility throughout
and
modified, t
Changes
Figure
Table
characteristics.
characteristics.
Table 58: TS characteristics on
Table 6: FSMC pin definition on
modified and V
82, note 1 modified.
11,
17).
h(NSS)
Figure
characteristics.
added.
modified in
38.
12,
89. f
corrected.
and
updated.
43.
DDA
modified.
Figure
PCLK2
Table 56: ADC
11.
85.
(see
added to
Figure 42:
updated.
14,
(see
corrected
Table
35.
and
18,

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