STM32F101VDT6 STMicroelectronics, STM32F101VDT6 Datasheet - Page 38

MCU ARM 32BIT 384K FLASH 100LQFP

STM32F101VDT6

Manufacturer Part Number
STM32F101VDT6
Description
MCU ARM 32BIT 384K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101VDT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM3210E-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
5.3
5.3.1
5.3.2
5.3.3
38/106
Operating conditions
General operating conditions
Table 10.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Operating conditions at power-up / power-down
The parameters given in
temperature condition summarized in
Table 11.
Embedded reset and power control block characteristics
The parameters given in
temperature and V
Symbol
Symbol
V
f
f
f
PCLK1
PCLK2
between V
characteristics on page
Table 6.2: Thermal characteristics on page
V
DDA
t
HCLK
V
VDD
P
T
T
BAT
DD
A
D
J
A
(1)
is lower, higher P
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
85 °C
Ambient temperature
Junction temperature range
V
V
DD
General operating conditions
Operating conditions at power-up / power-down
DD
DD
and V
rise time rate
fall time rate
(3)
Parameter
DD
DDA
Parameter
D
supply voltage conditions summarized in
99).
can be tolerated during power-up and operation.
values are allowed as long as T
Table 11
Table 12
DD
A
Table 53: ADC
and V
can be extended to this range as long as T
Doc ID 14610 Rev 7
A
=
are derived from tests performed under the ambient
are derived from tests performed under ambient
DDA
Table
99).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP144
LQFP100
LQFP64
Maximum power dissipation
Low power dissipation
STM32F101xC, STM32F101xD, STM32F101xE
10.
Conditions
DD
J
(2)
does not exceed T
Conditions
(4)
Table
J
J
max (see
does not exceed T
Min
10.
20
0
Min
–40
–40
–40
2.4
1.8
0
0
0
2
2
Table 6.2: Thermal
Max
Max
666
434
444
105
105
3.6
3.6
3.6
3.6
36
36
36
85
J
max (see
MHz
Unit
mW
Unit
µs/V
°C
°C
°C
V
V
V

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