STM32F101VDT6 STMicroelectronics, STM32F101VDT6 Datasheet - Page 51

MCU ARM 32BIT 384K FLASH 100LQFP

STM32F101VDT6

Manufacturer Part Number
STM32F101VDT6
Description
MCU ARM 32BIT 384K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101VDT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM3210E-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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STM32F101xC, STM32F101xD, STM32F101xE
High-speed external clock generated from a crystal/ceramic resonator
The high-speed external (HSE) clock can be supplied with a 4 to 16 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
Table 23.
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Based on characterization results, not tested in production.
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a
4. t
For C
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of C
can be used as a rough estimate of the combined pin and board capacitance) when sizing
C
microcontrollers” available from the ST website www.st.com.
t
SU(HSE)
L1
Symbol
f
OSC_IN
humid environment, due to the induced leakage and the bias condition change. However, it is
recommended to take this point into account if the MCU is used in tough humidity conditions.
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
SU(HSE)
R
g
and C
C
i
2
m
L1
F
(4)
and C
is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
L2
Oscillator frequency
Feedback resistor
Recommended load capacitance
versus equivalent serial
resistance of the crystal (R
HSE driving current
Oscillator transconductance
Startup time
. Refer to the application note AN2867 “Oscillator design guide for ST
HSE 4-16 MHz oscillator characteristics
L2
, it is recommended to use high-quality external ceramic capacitors in the
Parameter
L1
and C
Doc ID 14610 Rev 7
L2
. PCB and MCU pin capacitance must be included (10 pF
S
)
(3)
R
V
V
load
Startup
V
DD
IN
S
DD
= 30
= V
= 3.3 V
Conditions
is stabilized
Figure
SS
with 30 pF
(1)(2)
19). C
Table
L1
Min
Electrical characteristics
and C
25
4
23. In the application,
L2
Typ
200
30
8
2
are usually the
Max
16
1
mA/V
51/106
MHz
Unit
mA
ms
k
pF

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