MCU ARM 32BIT 384K FLASH 100LQFP

STM32F101VDT6

Manufacturer Part NumberSTM32F101VDT6
DescriptionMCU ARM 32BIT 384K FLASH 100LQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F101VDT6 datasheet
 


Specifications of STM32F101VDT6

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed36MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDTNumber Of I /o80
Program Memory Size384KB (384K x 8)Program Memory TypeFLASH
Ram Size48K x 8Voltage - Supply (vcc/vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x12bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case100-LQFP
Processor SeriesSTM32F101xCoreARM Cortex M3
Data Bus Width32 bitData Ram Size48 KB
Interface TypeI2C, SPI, USARTMaximum Clock Frequency36 MHz
Number Of Programmable I/os80Number Of Timers6
Maximum Operating Temperature+ 85 CMounting StyleSMD/SMT
3rd Party Development ToolsEWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2Development Tools By SupplierSTM3210E-EVAL
Minimum Operating Temperature- 40 COn-chip Adc12 bit, 16 Channel
On-chip Dac12 bit, 2 ChannelFeatured ProductSTM32 Cortex-M3 Companion Products
Eeprom Size-For Use With497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS StatusLead free / RoHS CompliantEeprom Size-
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STM32F101xC, STM32F101xD, STM32F101xE
Table 56.
ADC accuracy
Symbol
ET
Total unadjusted error
EO
Offset error
EG
Gain error
ED
Differential linearity error
EL
Integral linearity error
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC accuracy vs. negative injection current: Injecting negative current on any of the standard (non-robust)
analog input pins should be avoided as this significantly reduces the accuracy of the conversion being
performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to standard
analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
4. Based on characterization, not tested in production.
Figure 45. ADC accuracy characteristics
V
[1LSB
=
IDEAL
4095
4094
4093
7
6
5
E
O
4
3
2
1
0
1
2
V
SSA
(1) (2)(3)
Parameter
Test conditions
f
= 28 MHz,
PCLK2
f
= 14 MHz, R
ADC
V
= 2.4 V to 3.6 V
DDA
Measurements made after
ADC calibration
DD
V
REF+
DDA
(or
depending on package)]
4096
4096
(2)
E
T
(3)
(1)
E
L
E
D
1 LSB
IDEAL
3
4
5
6
7
4093 4094 4095 4096
Doc ID 14610 Rev 7
Electrical characteristics
Typ
Max
±2
±1.5
±2.5
< 10 k,
AIN
±1.5
±1
±1.5
, frequency, V
and temperature ranges.
REF
and I
in
Section 5.3.13
INJ(PIN)
INJ(PIN)
E
G
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
=Total Unadjusted Error: maximum deviation
T
between the actual and the ideal transfer curves.
E
=Offset Error: deviation between the first actual
O
transition and the first ideal one.
E
=Gain Error: deviation between the last ideal
G
transition and the last actual one.
E
=Differential Linearity Error: maximum deviation
D
between actual steps and the ideal one.
E
=Integral Linearity Error: maximum deviation
L
between any actual transition and the end point
correlation line.
V
DDA
(4)
Unit
±5
±3
LSB
±2
±3
does not
ai14395b
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