STM32F101RCT6 STMicroelectronics, STM32F101RCT6 Datasheet - Page 92

MCU ARM 32BIT 256KB FLASH 64LQFP

STM32F101RCT6

Manufacturer Part Number
STM32F101RCT6
Description
MCU ARM 32BIT 256KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101RCT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM3210E-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-9031
STM32F101RCT6

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0
Electrical characteristics
Table 57.
1. Guaranteed by characterization, not tested in production.
2. Guaranteed by design, not tested in production.
3. Guaranteed by characterization, not tested in production.
92/106
I
I
DNL
INL
Offset
Gain error
t
Update rate
t
PSRR+
DDVREF+
DDA
SETTLING
WAKEUP
Symbol
(3)
(3)
(3)
(2)
(3)
(3)
(3)
(3)
DAC characteristics (continued)
DAC DC current consumption
in quiescent mode (Standby
mode)
DAC DC current consumption
in quiescent mode (Standby
mode)
Differential non linearity
Difference between two
consecutive code-1LSB)
Integral non linearity (difference
between measured value at
Code i and the value at Code i
on a line drawn between Code
0 and last Code 1023)
Offset error
(difference between measured
value at Code (0x800) and the
ideal value = V
Gain error
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final value
±1LSB
Max frequency for a correct
DAC_OUT change when small
variation in the input code (from
code i to i+1LSB)
Wakeup time from off state
(Setting the ENx bit in the DAC
Control register)
Power supply rejection ratio (to
V
DDA
) (static DC measurement
Parameter
REF+
/2)
Doc ID 14610 Rev 7
Min
3
6.5
–67
Typ
STM32F101xC, STM32F101xD, STM32F101xE
220
380
480
±0.5
±2
±1
±4
±10
±3
±12
±0.5
4
1
10
–40
Max
(1)
µA
µA
µA
LSB
LSB
LSB
LSB
mV
LSB
LSB
%
µs
MS/s C
µs
dB
Unit
With no load, worst code
(0xF1C) at V
terms of DC consumption on
the inputs.
With no load, middle code
(0x800) on the inputs.
With no load, worst code
(0xF1C) at V
terms of DC consumption on
the inputs.
Given for the DAC in 10-bit
configuration.
Given for the DAC in 12-bit
configuration.
Given for the DAC in 10-bit
configuration.
Given for the DAC in 12-bit
configuration.
Given for the DAC in 12-bit
configuration.
Given for the DAC in 10-bit at
V
Given for the DAC in 12-bit at
V
Given for the DAC in 12bit
configuration.
C
C
input code between lowest and
highest possible ones.
No R
REF+
REF+
LOAD
LOAD
LOAD
LOAD
= 3.6 V.
= 3.6 V.
 50 pF, R
 50 pF, R
 50 pF, R
Comments
, C
REF+
REF+
LOAD
LOAD
LOAD
LOAD
= 3.6 V in
= 3.6 V in
= 50 pF
 5 k
 5 k
 5 k

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