MCU ARM9 2048KB FLASH 128LQFP

 

STR912FAW47X6T

Manufacturer Part NumberSTR912FAW47X6T
DescriptionMCU ARM9 2048KB FLASH 128LQFP
ManufacturerSTMicroelectronics
SeriesSTR9
STR912FAW47X6T datasheets

Availability: By request

International delivery:

Warranty: 60 days

Shipping & payment terms

Added to cart

 

Specifications of STR912FAW47X6T

Core ProcessorARM9Core Size32-Bit
Speed96MHzConnectivityCAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDTNumber Of I /o80
Program Memory Size2MB (2M x 8)Program Memory TypeFLASH
Ram Size96K x 8Voltage - Supply (vcc/vdd)1.65 V ~ 2 V
Data ConvertersA/D 8x10bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case128-LQFP
Processor SeriesSTR912xCoreARM966E-S
Data Bus Width16 bit, 32 bitData Ram Size96 KB
Interface TypeCAN, I2C, IrDA, SSP, UART, USBMaximum Clock Frequency96 MHz
Number Of Programmable I/os80Number Of Timers4
Maximum Operating Temperature+ 85 CMounting StyleSMD/SMT
3rd Party Development ToolsEWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2Minimum Operating Temperature- 40 C
On-chip Adc10 bit, 8 ChannelFor Use WithMCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS StatusLead free / RoHS CompliantEeprom Size-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
Page 41
42
Page 42
43
Page 43
44
Page 44
45
Page 45
46
Page 46
47
Page 47
48
Page 48
49
Page 49
50
Page 50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
Page 45/102

Download datasheet (3Mb)Embed
PrevNext
STR91xFAxxx
5.1
LFBGA144 ball connections
In
Table 7
balls labelled NC are no connect balls. These NC balls are reserved for
future devices and should NOT be connected to ground or any other signal. There are
total of 9 NC (no connection) balls.
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and
EMI_WRHn). These two balls can also be configured by the user as EMI low or high
byte select signals (EMI_LBn and EMI_UBn).
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.
Table 7.
STR91x LFBGA144 ball connections
A
B
C
1
P4.2
P7.2
NC
2
AVREF
P4.1
P4.0
3
AVDD
P4.3
AVSS
4
P4.6
P4.5
P4.4
5
P7.7
VDDQ
VSSQ
6
JTMS
JTDO
JTDI
7
P1.5
P1.4
NC
8
VSSQ
PLLVSSQ
P1.3
RESET_
9
P1.2
PLLVDDQ
OUTn
10
X1_CPU
P1.0
P1.1
(2)
11
X2_CPU
JRTCK
USBDP
EMI_
RESET_
12
P0.7
WEn
INn
1.
A
No PHYCLK function on STR910F
W devices.
2.
A
No USBCLK function on STR910F
W devices.
3.
NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.
D
E
F
G
P7.0
VDDQ
P7.3
P7.4
P7.1
P2.0
NC
P6.2
NC
P2.1
VSS
P6.3
EMI_BWR_
VSSQ
P5.0
VDD
WRLn
(EMI_LBn)
P4.7
P7.5
NC
VSSQ
P1.7
P7.6
P5.1
P2.6
VDD
VSS
P1.6
P6.5
JRSTn
JTCK
VSSQ
P6.4
VDDQ
P6.6
VDDQ
NC
TAMPER_
(3)
USBDN
NC
VSS
IN
MII_
P0.6
P0.5
VDD
(3)
MDIO
P6.7
NC
NC
P5.7
Doc ID 13495 Rev 6
Pin description
H
J
K
L
EMI_WRHn
VDDQ
PHYCLK_
P8.0
(EMI_UBn)
(1)
P5.2
P5.3
P8.2
P8.3
VSSQ
P8.1
P6.1
P2.3
P8.4
P6.0
P8.5
VSSQ
P2.4
VSS
P2.5
P8.7
VDDQ
P9.4
P9.3
P9.2
VDD
USBCLK_
VDDQ
VSSQ
P3.0
P2.7
EMI_
EMI_BAAn
P3.3
P9.5
WAITn
EMI_
P5.6
P9.7
P3.4
RDn
EMI_
P0.4
P0.1
P3.5
ALE
P5.5
P0.2
P3.7
P0.0
P0.3
P5.4
VDDQ
VSSQ
M
P2.2
P8.6
VBATT
X2_
RTC
X1_
RTC
P9.0
P9.1
(2)
EMI_
BCLK
P9.6
P3.1
P3.2
P3.6
45/102