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STR912FAW47X6T
STR912FAW47X6T | |
|---|---|
| Manufacturer Part Number | STR912FAW47X6T |
| Description | MCU ARM9 2048KB FLASH 128LQFP |
| Manufacturer | STMicroelectronics |
| Series | STR9 |
| STR912FAW47X6T datasheets |
|
Availability: By request
International delivery:
Warranty: 60 days
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Specifications of STR912FAW47X6T | |||
|---|---|---|---|
| Core Processor | ARM9 | Core Size | 32-Bit |
| Speed | 96MHz | Connectivity | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | Number Of I /o | 80 |
| Program Memory Size | 2MB (2M x 8) | Program Memory Type | FLASH |
| Ram Size | 96K x 8 | Voltage - Supply (vcc/vdd) | 1.65 V ~ 2 V |
| Data Converters | A/D 8x10b | Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C | Package / Case | 128-LQFP |
| Processor Series | STR912x | Core | ARM966E-S |
| Data Bus Width | 16 bit, 32 bit | Data Ram Size | 96 KB |
| Interface Type | CAN, I2C, IrDA, SSP, UART, USB | Maximum Clock Frequency | 96 MHz |
| Number Of Programmable I/os | 80 | Number Of Timers | 4 |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| 3rd Party Development Tools | EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2 | Minimum Operating Temperature | - 40 C |
| On-chip Adc | 10 bit, 8 Channel | For Use With | MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Eeprom Size | - |
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STR91xFAxxx
Table 48.
ADC conversion time (silicon Rev G)
Symbol
Parameter
t
Single mode conversion time
CONV(S]
TR(S)
Single mode throughput rate
t
Continuous mode conversion time
CONV(C]
TR(C)
Continuous mode throughput rate
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev G. Refer to
and to
Section 8: Device
marking.
3. Value obtained on conversions started by trigger in single mode
4. All sucessive conversions in continuous and scan modes.
Table 49.
ADC conversion time (silicon Rev H and higher)
Symbol
Parameter
t
Single mode conversion time
CONV(S]
TR(S)
Single mode throughput rate
t
Continuous mode conversion time
CONV(C]
TR(C)
Continuous mode throughput rate
t
Fast trigger mode conversion time
CONV(FT]
TR(FT)
Fast trigger mode throughput rate
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev H and higher. Refer to
memory and to
Section 8: Device
3. Value obtained from conversions started by trigger in single mode
4. All successive conversions in continuous and scan modes.
5. Conversion started by trigger when automatic clock gated mode enabled. Fast trigger mode is available only in devices with
silicon Rev H and higher.
6. Value obtained from conversions started by fast trigger in single mode
Test
(1) (2)
conditions
f
= 24 MHz
ADC
(3)
f
= 24 MHz
ADC
(4)
f
= 24 MHz
ADC
f
= 24 MHz
ADC
Table 5
Test
(1) (2)
conditions
f
= 24 MHz
ADC
(3)
f
= 24 MHz
ADC
(4)
f
= 24 MHz
ADC
f
= 24 MHz
ADC
(5)
f
= 24 MHz
ADC
(6)
f
= 24 MHz
ADC
marking.
Doc ID 13495 Rev 6
Electrical characteristics
Value
Min
Typ
Max
2*16/f
3*16/f
ADC
ADC
1.33
2
500
1*16/f
ADC
0.66
1500
for device rev identification in OTP memory
Value
Min
Typ
Max
1*16/f
2*16/f
ADC
ADC
0.66
1.33
750
1*16/f
ADC
0.66
1500
1*16/f
ADC
0.66
100
1200
Table 5
for device rev identification in OTP
Unit
µs
ksps
µs
µs
ksps
Unit
µs
ksps
µs
µs
ksps
µs
µs
ksps
91/102
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