MCU ARM9 2048KB FLASH 128LQFP

 

STR912FAW47X6T

Manufacturer Part NumberSTR912FAW47X6T
DescriptionMCU ARM9 2048KB FLASH 128LQFP
ManufacturerSTMicroelectronics
SeriesSTR9
STR912FAW47X6T datasheets

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Warranty: 60 days

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Specifications of STR912FAW47X6T

Core ProcessorARM9Core Size32-Bit
Speed96MHzConnectivityCAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDTNumber Of I /o80
Program Memory Size2MB (2M x 8)Program Memory TypeFLASH
Ram Size96K x 8Voltage - Supply (vcc/vdd)1.65 V ~ 2 V
Data ConvertersA/D 8x10bOscillator TypeInternal
Operating Temperature-40°C ~ 85°CPackage / Case128-LQFP
Processor SeriesSTR912xCoreARM966E-S
Data Bus Width16 bit, 32 bitData Ram Size96 KB
Interface TypeCAN, I2C, IrDA, SSP, UART, USBMaximum Clock Frequency96 MHz
Number Of Programmable I/os80Number Of Timers4
Maximum Operating Temperature+ 85 CMounting StyleSMD/SMT
3rd Party Development ToolsEWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2Minimum Operating Temperature- 40 C
On-chip Adc10 bit, 8 ChannelFor Use WithMCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS StatusLead free / RoHS CompliantEeprom Size-
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Download datasheet (3Mb)Embed
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STR91xFAxxx
Figure 42. 144-ball low profile fine pitch ball grid array package (LFBGA144) outline
Table 52.
144-ball low profile fine pitch ball grid array package (LFBGA144) mechanical data
Dim.
Min
A
1.21
A1
0.21
A2
b
0.35
D
9.85
D1
E
9.85
E1
e
F
ddd
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.
mm
Typ
Max
1.70
0.0476
0.0083
1.085
0.40
0.45
0.0138
10.00
10.15
0.3878
8.80
10.00
10.15
0.3878
8.80
0.80
0.60
0.10
0.15
0.08
Doc ID 13495 Rev 6
Package mechanical data
(1)
inches
Min
Typ
0.0427
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
Max
0.0669
0.0177
0.3996
0.3996
0.0039
0.0059
0.0031
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