MC908LJ24CFQE Freescale Semiconductor, MC908LJ24CFQE Datasheet - Page 454

• Manufacturer Part Number: MC908LJ24CFQE
• Description: IC MCU 24K FLASH 8MHZ SPI 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908LJ24CFQE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number Of I /o: 48
• Program Memory Size: 24KB (24K x 8)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Controller Family/series: HC08
• No. Of I/o's: 48
• Ram Memory Size: 768Byte
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC08LJ
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 4
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, M68EML08LJLKE, ZK-HC08LX-A, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
25.5 80-Pin Low-Profile Quad Flat Pack (LQFP)
Data Sheet
454
4X
PIN 1
IDEx
A
A
0.200 C
20
A2
A1
1
Figure 25-3. 80-Pin Low-Profile Quad Flat Pack (Case No. 917)
21
80
A–B
D/2
D
8X
76X
2
e
D
VIEW P
D1
D
S
0.25
D1/2
VIEW P
Mechanical Specifications
61
40
(L1)
60
41
(L2)
4X
R
B
(R1)
1
R
E1/2
H
GAGE
PLANE
(R2)
L
0.200 H
VIEW Y
E1
C
E/2
0.1
SEATING
PLANE
A–B
C
E
D
MC68HC908LJ24/LK24 — Rev. 2.1
NOTES:
c
1. ALL DIMENSIONS AND TOLERANCES TO
2.
3.
4. DATUMS A, B AND D TO BE DETERMINED AT
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE
7. DIMENSION b DOES NOT INCLUDE DAMBAR
ROTATED 90 CLOCKWISE
CONFORM TO ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
DATUM PLANE H.
SEATING PLANE C.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
D1 AND E1 DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE H.
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35.
3 PLACES
DIM
VIEW Y
A1
A2
D1
E1
L1
L2
R1
R2
b1
c1
A
D
E
L
S
b
c
e
1
2
SECTION B–B
0.08
80 PLACES
MILLIMETERS
0.05
1.35
0.45
0.17
0.17
0.12
0.12
10
MIN
Freescale Semiconductor
—
0
0
14.00 BSC
12.00 BSC
14.00 BSC
12.00 BSC
M
1.00 REF
0.50 REF
0.20 REF
0.20 REF
0.17 REF
0.50 BSC
e/2
b1
b
B
B
C
MAX
1.60
0.15
1.45
0.75
0.27
0.23
0.20
0.16
14
7
—
A–B
X
D
X=A, B, or D
c1
BASE
METAL
PLATING