MC9S08GT60CFD Freescale Semiconductor, MC9S08GT60CFD Datasheet - Page 21

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MC9S08GT60CFD

Manufacturer Part Number
MC9S08GT60CFD
Description
MCU 8BIT 60K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GT60CFD

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Table 1-2
1.4
Some of the modules inside the MCU have clock source choices.
connection diagram. The ICG supplies the clock sources:
Freescale Semiconductor
ICG
ICGOUT is an output of the ICG module. It is one of the following:
— The external crystal oscillator
— An external clock source
— The output of the digitally-controlled oscillator (DCO) in the frequency-locked loop
Control bits inside the ICG determine which source is connected.
System Clock Distribution
lists the functional versions of the on-chip modules.
sub-module
ICGLCLK*
ICGERCLK
FFE
* ICGLCLK is the alternate BDC clock source for the MC9S08GB/GT.
ICGOUT
CPU
÷
CONTROL
2
SYSTEM
LOGIC
÷
2
FIXED FREQ CLOCK (XCLK)
Figure 1-3. System Clock Distribution Diagram
Serial Communications Interface (SCI)
Timer Pulse-Width Modulator (TPM)
RTI
BUSCLK
Analog-to-Digital Converter (ATD)
Serial Peripheral Interface (SPI)
Internal Clock Generator (ICG)
Central Processing Unit (CPU)
Inter-Integrated Circuit (IIC)
Keyboard Interrupt (KBI)
MC9S08GB/GT Data Sheet, Rev. 2.3
Table 1-2. Block Versions
Module
BDC
TPM1
TPM2
ATD has min and max
frequency requirements.
See
and
Characteristics.
IIC1
Figure 1-3
Appendix A, “Electrical
Chapter 1,
ATD1
Version
3
2
1
1
1
3
1
2
“Introduction”
SCI1
shows a simplified clock
RAM
SCI2
System Clock Distribution
FLASH has frequency
requirements for program
and erase operation.
See
Characteristics.
Appendix A, “Electrical
FLASH
SPI1
21

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