C8051F018-GQR Silicon Laboratories Inc, C8051F018-GQR Datasheet - Page 19

• Manufacturer Part Number: C8051F018-GQR
• Description: IC 8051 MCU 16K FLASH 64TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F018r

Specifications of C8051F018-GQR

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.25K x 8
• Voltage - Supply (vcc/vdd): 2.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 1.25 KB
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4 bit
• Operating Supply Voltage: 2.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F005DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4. PINOUT AND PACKAGE DEFINITIONS
19
VDD
DGND
AV+
AGND
TCK
TMS
TDI
TDO
XTAL1
XTAL2
/RST
VREF
CP0+
CP0-
CP1+
CP1-
NC
NC
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
Name
C8051F018
C8051F019
F018
31,
40,
30,
41,
16,
62
61
17
15
22
21
28
29
18
19
20
64
63
10
11
12
13
14
5,
6
4
3
2
1
7
8
9
Type
F019
23,
22,
33,
27,
13,
44,
32
19
43
12
18
17
20
21
14
15
16
45
46
48
47
10
11
3
2
1
4
5
6
7
8
9
Description
D In
D In
D In
D Out
A In
A Out
D I/O
A I/O
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
A In
Digital Voltage Supply.
Digital Ground.
Positive Analog Voltage Supply.
Analog Ground.
JTAG Test Clock with internal pull-up.
JTAG Test-Mode Select with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is latched on a rising edge of
TCK.
JTAG Test Data Output with internal pull-up. Data is shifted out on TDO on
the falling edge of TCK. TDO output is a tri-state driver.
Crystal Input. This pin is the return for the internal oscillator circuit for a
crystal or ceramic resonator. For a precision internal clock, connect a crystal
or ceramic resonator from XTAL1 to XTAL2. If overdriven by an external
CMOS clock, this becomes the system clock.
Crystal Output. This pin is the excitation driver for a crystal or ceramic
resonator.
Chip Reset. Open-drain output of internal Voltage Supply monitor. Is driven
low when VDD is < 2.8V. An external source can force a system reset by
driving this pin low.
Voltage Reference. When configured as an input, this pin is the voltage
reference for the MCU. Otherwise, the internal reference drives this pin.
Comparator 0 Non-Inverting Input.
Comparator 0 Inverting Input.
Comparator 1 Non-Inverting Input.
Comparator 1 Inverting Input.
No Connect Pin. This pin should be left open.
No Connect Pin. This pin should be left open.
Analog Mux Channel Input 0. (See ADC Specification for complete
description).
Analog Mux Channel Input 1. (See ADC Specification for complete
description).
Analog Mux Channel Input 2. (See ADC Specification for complete
description).
Analog Mux Channel Input 3. (See ADC Specification for complete
description).
Analog Mux Channel Input 4. (See ADC Specification for complete
description).
Analog Mux Channel Input 5. (See ADC Specification for complete
description).
Analog Mux Channel Input 6. (See ADC Specification for complete
description).
Analog Mux Channel Input 7. (See ADC Specification for complete
description).
Table 4.1. Pin Definitions
Rev. 1.2