MC68HC11E1CFNE3R Freescale Semiconductor, MC68HC11E1CFNE3R Datasheet - Page 182

• Manufacturer Part Number: MC68HC11E1CFNE3R
• Description: MCU 8-BIT 512 RAM 3MHZ 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11E1CFNE3R

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-PLCC
• Processor Series: HC11E
• Core: HC11
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

Ordering Information and Mechanical Specifications
11.5 52-Pin Plastic-Leaded Chip Carrier (Case 778)
182
–L–
C
0.010 (0.25)
52
K1
Z
K
G
VIEW S
S
G1
T
L–M
–N–
1
F
H
S
N
S
0.007 (0.18)
M68HC11E Family Data Sheet, Rev. 5.1
VIEW S
0.007 (0.18)
A
V
R
–M–
J
Y
E
W
BRK
0.007 (0.18)
0.007 (0.18)
M
M
–T–
T
T
0.004 (0.100)
L–M
D
D
L–M
SEATING
PLANE
M
M
S
S
T
T
N
N
L–M
L–M
S
S
S
S
N
N
B
Z
S
S
VIEW D–D
X
U
0.007 (0.18)
NOTES:
0.007 (0.18)
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
AT DATUM –T–, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
M
G1
T
0.785
0.785
0.165
0.090
0.013
0.026
0.020
0.025
0.750
0.750
0.042
0.042
0.042
0.710
0.040
MIN
0.010 (0.25)
–––
0.050 BSC
L–M
2
INCHES
M
0.795
0.795
0.180
0.019
0.032
0.756
0.756
0.048
0.048
0.056
0.020
0.730
0.110
T
MAX
S
–––
–––
10
–––
L–M
N
Freescale Semiconductor
S
19.94
19.94
19.05
19.05
18.04
S
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
S
–––
1.27 BSC
2
T
N
L–M
MAX
20.19
20.19
19.20
19.20
18.54
S
4.57
0.48
0.81
1.21
1.21
1.42
0.50
2.79
–––
–––
10
–––
S
N
S