MC68HC705C9ACFBE Freescale Semiconductor, MC68HC705C9ACFBE Datasheet - Page 107

• Manufacturer Part Number: MC68HC705C9ACFBE
• Description: IC MCU 8BIT 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C9ACFBE

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• Ram Size: 352 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Processor Series: HC705C
• Core: HC05
• Data Bus Width: 8 bit
• Data Ram Size: 352 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 2.1 MHz
• Number Of Programmable I/os: 31
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Package: 44PQFP
• Family Name: HC05
• Maximum Speed: 2.1 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line
package (SDIP), plastic leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
Freescale Semiconductor
1
40
H
G
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
A
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
F
D
21
20
SEATING
PLANE
N
K
B
C
M
L
J
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
51.69
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
MILLIMETERS
0°
15.24 BSC
2.54 BSC
52.45
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
1°
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
0°
0.100 BSC
0.600 BSC
INCHES
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
1°
107