MC68HC11E1CFNE3 Freescale Semiconductor, MC68HC11E1CFNE3 Datasheet - Page 186

• Manufacturer Part Number: MC68HC11E1CFNE3
• Description: IC MCU 8BIT 3MHZ 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11E1CFNE3

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-PLCC
• Controller Family/series: 68HC11
• No. Of I/o's: 38
• Eeprom Memory Size: 512Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 3MHz
• No. Of Timers: 1
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Processor Series: HC11E
• Core: HC11
• Data Bus Width: 8 bit
• Program Memory Size: 512 B
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 8
• Operating Supply Voltage: 3 V to 5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

Ordering Information and Mechanical Specifications
11.9 56-Pin Dual in-Line Package (Case 859)
11.10 48-Pin Plastic DIP (Case 767)
186
SEATING
PLANE
-T-
SEATING
PLANE
–T–
48
1
56
1
F
D
0.25 (0.010)
The MC68HC811E2 is the only member of the E series that is offered in a
48-pin plastic dual in-line package.
D
F
56 PL
32 PL
0.51 (0.020)
M
T
M
-A-
A
T
–A–
S
A
G
S
E
M68HC11E Family Data Sheet, Rev. 5.1
DETAIL X
G
0.25 (0.010)
25
24
N
0.25 (0.010)
J
C
NOTE
48 PL
29
28
-B-
K
N
J
M
56 PL
–B–
C
T
M
K
B
T
S
DETAIL X
B
L
TIP TAPER
S
H
L
M
M
48 PL
NOTES:
1.
2.
3.
4.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
MAXIMUM MOLD FLASH 0.25 (0.010).
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
DIM
DIM
A
B
C
D
G
H
K
M
N
F
J
L
A
B
C
D
E
G
H
K
M
N
F
J
L
2.415
0.540
0.155
0.014
0.040
0.008
0.115
0.020
MIN
2.035
0.540
0.155
0.014
0.032
0.008
0.020
0.115
MIN
0.100 BSC
0.070 BSC
0.600 BSC
0.035 BSC
0.070 BSC
0.300 BSC
0.600 BSC
0
INCHES
0
×
INCHES
Freescale Semiconductor
2.445
0.560
0.200
0.022
0.060
0.015
0.150
0.040
MAX
2.065
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
15
15
×
61.34
13.72
MILLIMETERS
51.69
13.72
MIN
3.94
0.36
1.02
0.20
2.92
0.51
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
15.24 BSC
2.54 BSC
1.79 BSC
0
1.778 BSC
15.24 BSC
0.89 BSC
7.62 BSC
0
×
62.10
14.22
MAX
MAX
52.45
14.22
5.08
0.55
1.52
0.38
3.81
1.01
15
5.08
0.56
1.17
0.38
3.43
1.02
15
×