MC68HC11E1VFNE3 Freescale Semiconductor, MC68HC11E1VFNE3 Datasheet - Page 183

• Manufacturer Part Number: MC68HC11E1VFNE3
• Description: MCU 8-BIT 512 RAM 3MHZ 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11E1VFNE3

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 52-PLCC
• Processor Series: HC11E
• Core: HC11
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 8
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Freescale Semiconductor
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
M68HC11E Family Data Sheet, Rev. 5.1
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
T
T
A
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
183