MC68HC711E9CFNE2 Freescale Semiconductor, MC68HC711E9CFNE2 Datasheet - Page 255

IC MCU 8BIT 512RAM 52-PLC

MC68HC711E9CFNE2

Manufacturer Part Number
MC68HC711E9CFNE2
Description
IC MCU 8BIT 512RAM 52-PLC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet

Specifications of MC68HC711E9CFNE2

Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Processor Series
HC711E
Core
HC11
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
2 MHz
Number Of Programmable I/os
38
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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12.3 52-Pin Plastic-Leaded Chip Carrier (Case 778)
M68HC11E Family — Rev. 3.2
MOTOROLA
–L–
C
0.010 (0.25)
52
K1
Z
K
G
VIEW S
S
G1
T
L–M
–N–
1
F
H
S
N
S
0.007 (0.18)
VIEW S
0.007 (0.18)
A
R
V
–M–
J
Y
E
W
BRK
0.007 (0.18)
0.007 (0.18)
M
M
–T–
Mechanical Data
T
T
0.004 (0.100)
L–M
D
L–M
D
SEATING
PLANE
M
M
S
S
T
T
N
N
L–M
L–M
S
S
S
S
N
N
B
Z
S
S
52-Pin Plastic-Leaded Chip Carrier (Case 778)
VIEW D–D
X
U
0.007 (0.18)
NOTES:
0.007 (0.18)
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
AT DATUM –T–, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
M
G1
T
0.785
0.785
0.165
0.090
0.013
0.026
0.020
0.025
0.750
0.750
0.042
0.042
0.042
0.710
0.040
MIN
0.010 (0.25)
–––
0.050 BSC
L–M
2
INCHES
_
M
0.795
0.795
0.180
0.110
0.019
0.032
0.756
0.756
0.048
0.048
0.056
0.020
0.730
T
MAX
S
–––
–––
10
–––
L–M
_
N
S
19.94
19.94
19.05
19.05
18.04
S
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
S
–––
1.27 BSC
2
T
_
N
L–M
Mechanical Data
20.19
20.19
19.20
19.20
18.54
MAX
S
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
–––
–––
10
–––
Technical Data
_
S
N
S
255

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