UPD78F9212CS-CAB-A Renesas Electronics America, UPD78F9212CS-CAB-A Datasheet - Page 353

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UPD78F9212CS-CAB-A

Manufacturer Part Number
UPD78F9212CS-CAB-A
Description
MCU 8BIT 4KB FLASH 16PIN
Manufacturer
Renesas Electronics America
Series
78K0S/Kx1+r
Datasheet

Specifications of UPD78F9212CS-CAB-A

Core Processor
78K0S
Core Size
8-Bit
Speed
10MHz
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
13
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Flash
memory
On-chip
debug
function
Electrical
specifica-
tions
(Standard
product,
(A) grade
product)
Function
FLAPHC,
FLAPLC: Flash
address pointer
H/L compare
registers
Shifting to self
programming
mode
Shifting to
normal mode
Byte write
Connecting QB-
MINI2 to
78K0S/KY1
Circuit
Connection for
the Case Where
QB-MINI2 Is
Used for
Debugging and
Debugging of
INTP1 Pin Is
Performed Only
with Real
Machine
Absolute
maximum
ratings
X1 oscillator
characteristics
Details of
Function
Be sure to clear bits 4 to 7 of FLAPH and FLAPHC to 0 before executing the self
programming command. If the value of these bits is 1 when executing the self
programming command.
Set the number of the block subject to a block erase, verify, or blank check (same
value as FLAPH) to FLAPHC.
Clear FLAPLC to 00H when a block erase is performed, and FFH when a blank
check is performed.
Be sure to perform the series of operations described above using the user
program at an address where data is not erased or written.
If a write results in failure, erase the block once and write to it again.
The 78K0S/KY1+ has an on-chip debug function, which is provided for
development and evaluation. Do not use the on-chip debug function in products
designated for mass production, because the guaranteed number of rewritable
times of the flash memory may be exceeded when this function is used, and
product reliability therefore cannot be guaranteed. NEC Electronics is not liable
for problems occurring when the on-chip debug function is used.
The constants described in the circuit connection example are reference values.
If you perform flash programming aiming at mass production, thoroughly evaluate
whether the specifications of the target device are satisfied.
If debugging is performed with a real machine running, without using QB-MINI2,
write the user program using the QB-Programmer. Programs downloaded by the
debugger include the monitor program, and such a program malfunctions if it is
not controlled via QB-MINI2.
Product quality may suffer if the absolute maximum rating is exceeded even
momentarily for any parameter. That is, the absolute maximum ratings are rated
values at which the product is on the verge of suffering physical damage, and
therefore the product must be used under conditions that ensure that the absolute
maximum ratings are not exceeded.
When using the X1 oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating
• Always make the ground point of the oscillator capacitor the same potential as
• Do not ground the capacitor to a ground pattern through which a high current
• Do not fetch signals from the oscillator.
current flows.
V
flows.
SS
.
APPENDIX D LIST OF CAUTIONS
User’s Manual U16994EJ6V0UD
Cautions
p. 240
243, 245,
246
p. 240
p. 240
pp. 242,
p. 254
p. 279
p. 279
p. 281
p. 293
p. 294
Page
(14/15)
351

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