UPD78F1144AGB-GAH-AX Renesas Electronics America, UPD78F1144AGB-GAH-AX Datasheet - Page 817

• Manufacturer Part Number: UPD78F1144AGB-GAH-AX
• Description: MCU 16BIT 78K0R/KX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3r

Specifications of UPD78F1144AGB-GAH-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

representative.
Note
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
Wave soldering
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution For soldering methods and conditions other than those recommended below, contact an NEC
• 64-pin plastic LQFP (12 × 12)
μ
μ
μ
μ
μ
PD78F1142GK-GAJ-AX,
PD78F1143GK-GAJ-AX,
PD78F1144GK-GAJ-AX,
PD78F1145GK-GAJ-AX,
PD78F1146GK-GAJ-AX,
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Table 30-1. Surface Mounting Type Soldering Conditions (1/2)
μ
μ
μ
μ
μ
Note
PD78F1142AGK-GAJ-AX,
PD78F1143AGK-GAJ-AX,
PD78F1144AGK-GAJ-AX,
PD78F1145AGK-GAJ-AX,
PD78F1146AGK-GAJ-AX,
(after that, prebake at 125°C for 10 to 72 hours)
User’s Manual U17854EJ9V0UD
Soldering Conditions
μ
μ
μ
μ
μ
PD78F1142AGK(A)-GAJ-AX,
PD78F1143AGK(A)-GAJ-AX,
PD78F1144AGK(A)-GAJ-AX,
PD78F1145AGK(A)-GAJ-AX,
PD78F1146AGK(A)-GAJ-AX,
Note
(after that, prebake at 125°C for
IR60-107-3
WS60-107-1
Condition Symbol
Recommended
−
815