UPD78F1144AGB-GAH-AX Renesas Electronics America, UPD78F1144AGB-GAH-AX Datasheet - Page 856

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UPD78F1144AGB-GAH-AX

Manufacturer Part Number
UPD78F1144AGB-GAH-AX
Description
MCU 16BIT 78K0R/KX3 64-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3r
Datasheet

Specifications of UPD78F1144AGB-GAH-AX

Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
50
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD78F1144AGB-GAH-AX
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
UPD78F1144AGB-GAH-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
854
Electrical
specifications
(standard
products)
Electrical
specifications
((A) grade
products)
Function
During
communication
at different
potential (2.5 V,
3 V) (CSI mode)
(master mode,
SCK10... internal
clock output)
During
communication
at different
potential (2.5 V,
3 V) (CSI mode)
(slave mode,
SCK10...
external clock
input)
During
communication
at different
potential (2.5 V,
3 V) (simplified
I
Absolute
maximum ratings
X1 oscillator
characteristics
2
C mode)
Details of
Function
Select the TTL input buffer for SI10 and the N-ch open-drain output (V
mode for SO10 and SCK10 by using the PIM0 and POM0 registers.
Select the TTL input buffer for SI10 and SCK10 and the N-ch open-drain output (V
tolerance) mode for SO10 by using the PIM0 and POM0 registers.
Select the TTL input buffer and the N-ch open-drain output (V
SDA10 and the N-ch open-drain output (V
PIM0 and POM0 registers.
The 78K0R/KE3 has an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for
mass production, because the guaranteed number of rewritable times of the flash
memory may be exceeded when this function is used, and product reliability
therefore cannot be guaranteed.
occurring when the on-chip debug function is used.
Product quality may suffer if the absolute maximum rating is exceeded even
momentarily for any parameter. That is, the absolute maximum ratings are rated
values at which the product is on the verge of suffering physical damage, and
therefore the product must be used under conditions that ensure that the absolute
maximum ratings are not exceeded.
When using the X1 oscillator, wire as follows in the area enclosed by the broken
lines in the above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current
• Always make the ground point of the oscillator capacitor the same potential as V
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
flows.
APPENDIX B LIST OF CAUTIONS
User’s Manual U17854EJ9V0UD
Cautions
NEC Electronics is not liable for problems
DD
tolerance) mode for SCL10 by using the
DD
tolerance) mode for
DD
tolerance)
SS
DD
.
742, 743
746
759
pp.741,
pp.745,
pp.747,
748
p.758
pp.758,
p.760
Page
(30/33)

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