UPD78F1144AGB-GAH-AX Renesas Electronics America, UPD78F1144AGB-GAH-AX Datasheet - Page 867

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UPD78F1144AGB-GAH-AX

Manufacturer Part Number
UPD78F1144AGB-GAH-AX
Description
MCU 16BIT 78K0R/KX3 64-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3r
Datasheet

Specifications of UPD78F1144AGB-GAH-AX

Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
50
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD78F1144AGB-GAH-AX
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
UPD78F1144AGB-GAH-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
4th edition
Edition
Change of Figure 18-2 Timing of Reset by RESET Input
Change of Figure 18-3 Timing of Reset Due to Watchdog Timer Overflow
Change of Figure 18-4 Timing of Reset in STOP Mode by RESET Input
Addition of reset processing time to Figure 19-2 Timing of Generation of Internal
Reset Signal by Power-on-Clear Circuit and Low-Voltage Detector
Addition of 19.4 Caution for Power-on-Clear Circuit
Addition of operation stabilization time
Change of Caution 2 in Figure 20-3 Format of Low-Voltage Detection Level
Select Register (LVIS)
Addition of 20.5 Caution for Low Voltage Detector
Change of description of 22.1.1 (2) 000C1H/010C1H
Change of Figure 22-2 Format of User Option Byte(000C1H/010C1H)
Change of Figure 22-4 Format of On-chip Debug Option Byte(000C3H/010C3H)
Addition of description to 23. 4.1 (3) During writing by self programming
Addition of description to 23.5 (1) Background event control register (BECTL)
Addition of 23.6 Programming Method
Addition of 23.7 Security Settings
Addition of 23.8 Flash Memory Programming by Self-programming
Addition of chapter
Deletion of description of BCD correction carry register (BCDCY bit), etc.
Absolute Maximum Ratings
• Addition of regulator voltage (REGC)
• Change of Input voltage and output voltage
Addition of MIN. value and MAX. value in XT1 Oscillator Characteristics
DC characteristics
• Change of Note 1 in Output current, high (I
• Change of Note 2 in Output current, low (I
• Addition of Supply current
• Addition of Watchdog Timer operating current (I
• Addition of A/D Converter operating current (I
• Addition of DMA Controller operating current (I
• Addition of LVI operating current (I
Change of MIN. value of Conversion time (t
Addition of POC Circuit Characteristics
Addition of Supply Voltage Rise Time
Addition of LVI Circuit Characteristics
Addition of Data Memory STOP Mode Low Supply Voltage Data Retention
Characteristics
Revision of chapter
APPENDIX C REVISION HISTORY
User’s Manual U17854EJ9V0UD
LVI
Description
)
CONV
OL1
OH1
)
ADC
) of A/D Converter Characteristics
)
DMA
WDT
)
)
)
CHAPTER 18 RESET
FUNCTION
CHAPTER 19 POWER-
ON-CLEAR CIRCUIT
CHAPTER 20 LOW-
VOLTAGE DETECTOR
CHAPTER 22 OPTION
BYTE
CHAPTER 23 FLASH
MEMORY
CHAPTER 24 ON-CHIP
DEBUGGING
CHAPTER 25 BCD
CORRECTION CIRCUIT
CHAPTER 27
ELECTRICAL
SPECIFICATIONS
(TARGET)
APPENDIX A
DEVELOPMENT TOOLS
Chapter
(3/15)
865

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