UPD78F1144AGB-GAH-AX Renesas Electronics America, UPD78F1144AGB-GAH-AX Datasheet - Page 873

• Manufacturer Part Number: UPD78F1144AGB-GAH-AX
• Description: MCU 16BIT 78K0R/KX3 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3r

Specifications of UPD78F1144AGB-GAH-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

6th edition
Edition
Addition of addr5 to Table 26-2. Symbols in “Operation” Column
Change of operation of CALLT in Table 26-5. Operation List (15/17)
Change of specifications of μPD78F1142, 78F1143, 78F1144, 78F1145, and
78F1146 from target specifications to formal specifications
Absolute Maximum Ratings
• Change of Input voltage
• Change of condition of Output voltage
Change of Notes 1 in Internal Oscillator Characteristics
DC Characteristics
• Change of condition of Output current, high (I
• Change of condition of Output current, low (I
• Change of condition of Input voltage, high (V
• Change of condition of Input voltage, low (V
• Change of Cautions 2
• Change of Output voltage, high (V
• Change of Output voltage, low (V
• Change of condition of Input leakage current, high (I
• Change of condition of Input leakage current, low (I
• Change of Supply current (I
Notes 4, and
• Change of Supply current (I
Notes 4, and
AC Characteristics
(1) Basic operation
• Addition of figures of Minimum instruction execution time during main system
• Change of title in AC Timing Test Points
Change of figures and figure title in Supply Voltage Rise Time Timing
Addition of package drawing
Change of A.4.1 When using flash memory programmer FG-FP4 and FL-PR4
Change of A.4.2 When using on-chip debug emulator with programming
function QB-MINI2
Change of A.5.1 When using in-circuit emulator QB-78K0RKX3
Change of A.5.2 When using on-chip debug emulator with programming
function QB-MINI2
clock operation and Minimum instruction execution time during self
programming mode in (1) Basic operation
Remarks 4.
Remarks 3.
DD1
DD2
APPENDIX C REVISION HISTORY
) and addition of low consumption current mode,
) and addition of low consumption current mode,
User’s Manual U17854EJ9V0UD
OL2
OH2
Description
)
)
IL4
OL2
IH4
OH2
)
)
)
)
LIL2
LIH2
)
)
CHAPTER 26
INSTRUCTION SET
CHAPTER 27
ELECTRICAL
SPECIFICATIONS
CHAPTER 28
PACKAGE DRAWINGS
APPENDIX A
DEVELOPMENT TOOLS
Chapter
(9/15)
871