TS80C51RA2-VCA Atmel, TS80C51RA2-VCA Datasheet - Page 58

IC MCU 8BIT 256BYTE 40MHZ 40-DIP

TS80C51RA2-VCA

Manufacturer Part Number
TS80C51RA2-VCA
Description
IC MCU 8BIT 256BYTE 40MHZ 40-DIP
Manufacturer
Atmel
Series
80Cr
Datasheets

Specifications of TS80C51RA2-VCA

Core Processor
8051
Core Size
8-Bit
Speed
40/30MHz
Connectivity
UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
11. Electrical Characteristics
11.1
11.2
11.3
Table 11-1.
58
Ambiant Temperature Under Bias:
C = commercial......................................................0°C to 70°C
I = industrial ........................................................-40°C to 85°C
Storage Temperature .................................... -65°C to + 150°C
Voltage on V
Voltage on Any Pin to V
Power Dissipation .............................................................. 1 W
Symbol
V
V
V
V
V
V
OL1
OL2
IH1
OL
IH
IL
Absolute Maximum Ratings
Power Consumption Measurement
DC Parameters for Standard Voltage
AT/TS8xC51Rx2
Parameter
Input Low Voltage
Input High Voltage except XTAL1, RST
Input High Voltage, XTAL1, RST
Output Low Voltage, ports 1, 2, 3, 4, 5
Output Low Voltage, port 0
Output Low Voltage, ALE, PSEN
CC
DC Parameters in Standard Voltage
to V
SS
........................................-0.5 V to + 7 V
SS
........................-0.5 V to V
Since the introduction of the first C51 devices, every manufacturer made operating Icc measure-
ments under reset, which made sense for the designs were the CPU was running under reset. In
Atmel new devices, the CPU is no more active during reset, so the power consumption is very
low but is not really representative of what will happen in the customer system. That’s why, while
keeping measurements under Reset, Atmel presents a new way to measure the operating Icc:
Using an internal test ROM, the following code is executed:
Label:
Ports 1, 2, 3 are disconnected, Port 0 is tied to FFh, EA = Vcc, RST = Vss, XTAL2 is not con-
nected and XTAL1 is driven by the clock.
This is much more representative of the real operating Icc.
T
T
A
A
= 0°C to +70°C; V
= -40°C to +85°C; V
(6)
(6)
SS
CC
SS
= 0 V; V
+ 0.5 V
= 0 V; V
0.2 V
0.7 V
Min
-0.5
CC
CC
+ 0.9
CC
CC
= 5 V ± 10%; F = 0 to 40 MHz.
= 5 V ± 10%; F = 0 to 40 MHz.
*NOTICE:
Typ
SJMP Label (80 FE)
S
lute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Power dissipation is based on the maximum
allowable die temperature and the thermal resis-
tance of the package.
tresses at or above those listed under “ Abso-
0.2 V
V
V
CC
CC
Max
0.45
0.45
0.45
0.3
1.0
0.3
1.0
0.3
1.0
CC
+ 0.5
+ 0.5
- 0.1
Unit
V
V
V
V
V
V
V
V
V
V
V
V
I
I
I
I
I
I
I
I
I
OL
OL
OL
OL
OL
OL
OL
OL
OL
= 100 µA
= 1.6 mA
= 3.5 mA
= 200 µA
= 3.2 mA
= 7.0 mA
= 100 µA
= 1.6 mA
= 3.5 mA
Test Conditions
4188F–8051–01/08
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)

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