MC68HC705C8ACP Freescale Semiconductor, MC68HC705C8ACP Datasheet - Page 13

• Manufacturer Part Number: MC68HC705C8ACP
• Description: IC MCU 4MHZ 8K OTP 40-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C8ACP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• Ram Size: 304 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -

MC68HC705C8A — Rev. 3
MOTOROLA
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10 3.3-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
13.11 5.0-Volt Serial Peripheral Interface (SPI) Timing . . . . . . . . . . 185
13.12 3.3-Volt Serial Peripheral Interface (SPI) Timing . . . . . . . . . . 187
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
Freescale Semiconductor, Inc.
For More Information On This Product,
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
Operating Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . 173
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
Power Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
5.0-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . .175
3.3-Volt DC Electrical Characteristics . . . . . . . . . . . . . . . . . .176
5.0-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
40-Pin Plastic Dual In-Line Package (PDIP). . . . . . . . . . . . . .192
40-Pin Ceramic Dual In-Line Package (Cerdip) . . . . . . . . . . . 193
44-Lead Plastic-Leaded Chip Carrier (PLCC) . . . . . . . . . . . . 194
44-Lead Ceramic-Leaded Chip Carrier (CLCC) . . . . . . . . . . . 195
44-Pin Quad Flat Pack (QFP). . . . . . . . . . . . . . . . . . . . . . . . . 196
42-Pin Shrink Dual In-Line Package (SDIP) . . . . . . . . . . . . . .197
Section 14. Mechanical Specifications
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Section 13. Electrical Specifications
Table of Contents
Table of Contents
Technical Data
13