MC68HC11E1CFN3 Freescale Semiconductor, MC68HC11E1CFN3 Datasheet - Page 201

IC MCU 3MHZ 512 EEPROM 52-PLCC

MC68HC11E1CFN3

Manufacturer Part Number
MC68HC11E1CFN3
Description
IC MCU 3MHZ 512 EEPROM 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet

Specifications of MC68HC11E1CFN3

Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Type
ROMless
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
3 MHz
Number Of Programmable I/os
22
Number Of Timers
16 bit
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Program Memory Size
-
Lead Free Status / Rohs Status
 Details

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Part Number
Manufacturer
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Price
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Manufacturer:
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11.8 52-Pin Thin Quad Flat Pack (Case 848D)
M68HC11E Family — Rev. 5
MOTOROLA
SEATING
PLANE
–H–
–T–
–L–
C
13
1
4X
52
14
0.20 (0.008) H L–M
S1
C2
A1
C1
Freescale Semiconductor, Inc.
0.05 (0.002)
A
S
VIEW AA
Ordering Information and Mechanical Specifications
For More Information On This Product,
3X
–N–
4X
4X
N
VIEW Y
S
2
3
Go to: www.freescale.com
40
26
Z
39
27
E
K
W
4X TIPS
1
–M–
0.20 (0.008) T L–M
B1
VIEW AA
2 X R
V1
GAGE PLANE
0.10 (0.004) T
0.25 (0.010)
R1
B
Ordering Information and Mechanical Specifications
V
N
C L
52-Pin Thin Quad Flat Pack (Case 848D)
PLATING
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
0.13 (0.005)
ROTATED 90 _ CLOCKWISE
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
J
A1
B1
C1
C2
R1
S1
V1
W
A
B
C
D
E
F
G
K
S
U
V
Z
É É É É
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
SECTION AB–AB
J
1
2
3
AB
AB
MILLIMETERS
MIN
0.05
1.30
0.20
0.45
0.22
0.07
0.08
0.09
–––
10.00 BSC
10.00 BSC
12.00 BSC
12.00 BSC
0
0
5
5.00 BSC
5.00 BSC
0.50 REF
6.00 BSC
0.65 BSC
6.00 BSC
0.20 REF
1.00 REF
12
_
_
_
VIEW Y
M
_
D
F
REF
MAX
T
1.70
0.20
1.50
0.40
0.75
0.35
0.20
0.20
0.16
–––
13
7
_
_
L–M
0.002
0.051
0.008
0.018
0.009
0.003
0.003
0.004
MIN
–––
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
0.026 BSC
0.020 REF
0.472 BSC
0.236 BSC
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
5
0
0
S
INCHES
12
_
_
_
U
_
N
REF
BASE METAL
MAX
0.067
0.008
0.059
0.016
0.030
0.014
0.008
0.008
0.006
–––
13
S
7
X=L, M, N
–X–
_
G
_
Data Sheet
201

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