MC68HC11E1CFN2R2 Freescale Semiconductor, MC68HC11E1CFN2R2 Datasheet - Page 199

• Manufacturer Part Number: MC68HC11E1CFN2R2
• Description: IC MCU 512 EEPROM 2MHZ 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11E1CFN2R2

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-PLCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Program Memory Size: -
• Other names: MC68HC11E1CFN2TR

11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
M68HC11E Family — Rev. 5
MOTOROLA
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
Freescale Semiconductor, Inc.
Ordering Information and Mechanical Specifications
A
For More Information On This Product,
S
B
N
D
K
S
H
52 PL
0.18 (0.007)
-B-
Go to: www.freescale.com
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
T
T
A
A
S
S
B
B
S
Ordering Information and Mechanical Specifications
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
Data Sheet
199