MC68HC11E1CFN2 Freescale Semiconductor, MC68HC11E1CFN2 Datasheet - Page 198

• Manufacturer Part Number: MC68HC11E1CFN2
• Description: IC MCU 512 EEPROM 2MHZ 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11E1CFN2

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Eeprom Size: 512 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-PLCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Program Memory Size: -

Ordering Information and Mechanical Specifications
11.5 52-Pin Plastic-Leaded Chip Carrier (Case 778)
Data Sheet
198
–L–
C
0.010 (0.25)
52
K1
Z
K
G
VIEW S
S
G1
T
L–M
–N–
1
Freescale Semiconductor, Inc.
F
H
S
Ordering Information and Mechanical Specifications
For More Information On This Product,
N
S
0.007 (0.18)
VIEW S
0.007 (0.18)
A
R
V
–M–
J
Y
E
Go to: www.freescale.com
W
BRK
0.007 (0.18)
0.007 (0.18)
M
M
–T–
T
T
0.004 (0.100)
L–M
D
D
L–M
SEATING
PLANE
M
M
S
S
T
T
N
N
L–M
L–M
S
S
S
S
N
N
B
Z
S
S
VIEW D–D
X
U
0.007 (0.18)
NOTES:
0.007 (0.18)
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
AT DATUM –T–, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM
G1
K1
G
W
A
B
C
E
F
H
J
K
R
U
V
X
Y
Z
M
G1
T
0.785
0.785
0.165
0.090
0.013
0.026
0.020
0.025
0.750
0.750
0.042
0.042
0.042
0.710
0.040
MIN
0.010 (0.25)
–––
0.050 BSC
L–M
2
INCHES
_
M
0.795
0.795
0.180
0.110
0.019
0.032
0.756
0.756
0.048
0.048
0.056
0.020
0.730
T
MAX
M68HC11E Family — Rev. 5
S
–––
–––
10
–––
L–M
_
N
S
19.94
19.94
19.05
19.05
18.04
S
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
S
–––
1.27 BSC
2
T
_
N
L–M
20.19
20.19
19.20
19.20
18.54
MAX
S
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
–––
–––
10
–––
_
S
MOTOROLA
N
S