MC68HC11E0CFN2 Freescale Semiconductor, MC68HC11E0CFN2 Datasheet - Page 199

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MC68HC11E0CFN2

Manufacturer Part Number
MC68HC11E0CFN2
Description
IC MCU 2MHZ 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet

Specifications of MC68HC11E0CFN2

Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC11E0CFN2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC11E0CFN2
Quantity:
17
11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
M68HC11E Family — Rev. 5
MOTOROLA
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
Freescale Semiconductor, Inc.
Ordering Information and Mechanical Specifications
A
For More Information On This Product,
S
B
N
D
K
S
H
52 PL
0.18 (0.007)
-B-
Go to: www.freescale.com
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
T
T
A
A
S
S
B
B
S
Ordering Information and Mechanical Specifications
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
Data Sheet
199

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