MC68HC711P2CFN4 Freescale Semiconductor, MC68HC711P2CFN4 Datasheet - Page 233

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MC68HC711P2CFN4

Manufacturer Part Number
MC68HC711P2CFN4
Description
IC MCU 32K OTP 4MHZ 84-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet

Specifications of MC68HC711P2CFN4

Core Processor
HC11
Core Size
8-Bit
Speed
4MHz
Connectivity
MI Bus, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
50
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Eeprom Size
640 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
84-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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12.4 Thermal characteristics and power considerations
MC68HC11P2 — Rev 1.0
The average chip junction temperature, T
obtained from the following equation:
where:
T
P
P
P
An approximate relationship between P
Solving equations [1] and [2] for K gives:
where K is a constant for a particular part. K can be determined by
measuring P
values of P
above equations. The package thermal characteristics are shown
below:
A
JA
D
INT
I/O
Freescale Semiconductor, Inc.
= Ambient temperature (°C)
= Total power dissipation = P
= Package thermal resistance, junction-to-ambient (°C/W)
= Power dissipation on input and output pins (User determined)
For More Information On This Product,
= Internal chip power = I
Thermal resistance
– 84-pin PLCC package
– 84-pin CERQUAD package (EPROM)
– 88-pin QFP package
D
Go to: www.freescale.com
D
and T
Electrical Specifications
(at equilibrium) for a known T
Characteristics
J
can be obtained for any value of T
K
=
P
T
J
D
P
=
DD
Thermal characteristics and power considerations
D
T
T
A
=
A
• V
INT
+
+
-------------------- -
T
273
J
P
DD
+ P
+
K
D
273
+
(W)
D
I/O
JA
JA
and T
J
, in degrees Celsius can be
(W)
A
Symbol
P
. Using this value of K, the
D
2
JA
J
(if P
Electrical Specifications
I/O
Value
TBD
50
50
A
is neglected) is:
, by solving the
Technical Data
°C/W
Unit
[1]
[2]
[3]

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